Water cooling device

Abstract

A water cooling device includes a communication structure, a water cooling structure and a driving device. The communication structure includes a first chamber and a second chamber. The water cooling structure includes plural water tubes. The driving device is installed in at least one of the first chamber and the second chamber. The first chamber includes a water inlet and plural inlet ports. The second chamber comprises a water outlet and plural outlet ports. The water inlet and the water outlet are formed in the same lateral surface of the communication structure. At least two additional lateral surfaces of the communication structure are located beside the water cooling structure. The plural water tubes are in communication with the plural inlet ports and the plural outlet ports. A cooling medium is guided to flow through the plural water tubes. The water cooling device can prevent the generated heat of the driving device from diffusing to the heat dissipation region while effectively increasing the space utilization of the overall water cooling system.

Description

technical field [0001] The present invention relates to a water-cooling heat dissipation device, in particular to a water-cooling heat dissipation device that can effectively improve overall space utilization and heat dissipation performance. Background technique [0002] With the improvement of the performance of electronic products, the internal integrated circuit structure is becoming more and more complex, and with it, the heat energy of electronic products is getting higher and higher. If the heat energy cannot be dissipated in real time, the integrated circuit inside the packaged chip may be burned. Therefore, the performance of heat dissipation must be improved to maintain the normal operation of the chip. [0003] Compared with various heat dissipation structures applied to electronic products, one of them is a water-cooled heat dissipation structure. It uses liquid to take heat energy away from the chip, and then conducts heat exchange with air to dissipate the ab...

AI Technical Summary

Problems solved by technology

However, when the pump itself is in operation, it will generate heat energy, which indirectly increases the heat source that should be dissipated in this area.

[0005] Moreover, if the heat energy generated by the pump is not properly discharged during operation, it will also reduce the efficiency of the pump, so that the overall heat dissipation effect of the water-cooled heat sink cannot be as good as imagined

[0006] Furthermore, the installation position of the pump on the existing water-cooling system is also limited by the available space inside the object to be radiated, which is not conducive to the use and design of space.

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