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Array substrate and manufacturing method therefor

A technology of an array substrate and a manufacturing method, applied in the display field, can solve the problems of ITO corrosion, abnormal panel display, affecting the production yield and service performance of the panel, etc., so as to avoid direct contact and improve the production yield and service performance.

Active Publication Date: 2017-09-15
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, the frame glue materials on the market, after being applied to the panel, will cause corrosion of the ITO in the GOA circuit area under the frame glue due to water absorption or adhesion problems during the high-temperature and high-humidity test stage, and eventually cause the panel to appear. Display abnormalities and other failure modes, which affect the production yield and performance of the panel

Method used

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  • Array substrate and manufacturing method therefor
  • Array substrate and manufacturing method therefor
  • Array substrate and manufacturing method therefor

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Embodiment Construction

[0027] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings. Apparently, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0028] refer to figure 1 , figure 1 A schematic structural diagram of an array substrate provided in a preferred embodiment of the present invention. Such as figure 1 As shown, the array substrate in this preferred embodiment includes a display area 101 and a non-display area (not shown in the figure), and the non-display area includes a GOA area 102 . Wherein, on the display area 101, data lines 1012 and scan lines 1011 ...

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Abstract

The invention provides an array substrate and a manufacturing method therefor. The array substrate comprises a display region and a non-display region; the non-display region comprises a GOA region; and a first metal layer, an insulating layer, a second metal layer and a protection layer are formed on the GOA region from the bottom up in sequence, wherein the second metal layer is connected with the first metal layer through a via hole; and the protection layer covers the second metal layer for protecting the circuit in the GOA region from being corroded. According to the array substrate and the manufacturing method therefor, the second metal layer is directly connected with the first metal layer through the via hole, and the protection layer is formed on the second metal layer, so that direct contact between metal and frame adhesive can be avoided, thereby protecting the circuit in the GOA region on the array substrate from being corroded, and improving production yield and use performance of the panel.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to an array substrate and a manufacturing method thereof. Background technique [0002] The development trend of Thin Film Transistor Liquid Crystal Display (TFT-LCD) is bound to be ultra-narrow frame and ultra-low cost. In order to achieve such a purpose, more and more panel manufacturers have introduced GOA (Gate driver On Array, array substrate row driving) technology, that is, directly fabricating gate driver circuits on the array substrate. [0003] However, with the development of narrow bezels and high-resolution panels, the circuit design in the GOA area occupies more and more areas on both sides of the display area, resulting in the continuous reduction of the area that can be occupied by the frame glue, and eventually inevitably occupies the GOA area circuit. The circuit in the GOA area will design a large number of via holes due to the transmission of signals. F...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/12H01L21/77
CPCH01L27/1244H01L27/1248H01L27/1259H01L27/124G02F1/1362G02F1/13454H01L27/1262
Inventor 雍玮娜徐向阳
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD