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A kind of production method of usb TYPE-C module

A production method and module technology, applied in the assembly/disassembly of contacts, circuit/collector components, electrical components, etc., can solve the problems of high probability of false soldering, rough melting point, re-welding and tin climbing difficulties, etc. Achieve the effect of excellent welding quality and material saving

Active Publication Date: 2019-06-07
深圳市宇隆宏天科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the flux in the melted solder paste has been volatilized by heating, it will be very difficult to weld and climb the tin again, the probability of false soldering is high, the melting point is rough, and clutter will be generated when the signal is too high

Method used

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  • A kind of production method of usb TYPE-C module
  • A kind of production method of usb TYPE-C module
  • A kind of production method of usb TYPE-C module

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0030] Embodiment 1 (electronic components are pasted on both sides of the PCB board)

[0031] The USB TYPE-C module involved in this embodiment includes a connector 1 with double rows of pins, a PCB board 3 and an electronic component 2A arranged on the front side of the PCB board 3 and an electronic component 2B on the back side; the PCB board 3 The tongue of the front section is inserted into the corresponding positioning groove of the connector 1 for positioning, and the two rows of pins of the connector 1 are sandwiched and welded to the corresponding pads on both sides of the PCB 3 .

[0032] A kind of production method of USB TYPE-C module of the present invention specifically comprises the following steps:

[0033] Step 1. Prepare PCB puzzle 4

[0034] Such as image 3 As shown, the PCB panel 4 is composed of a plurality of strip circuit boards 12 arranged side by side in turn, and a V-shaped groove 5 is arranged on the board process side of the PCB panel 4, through ...

Embodiment 2

[0044] Embodiment 2 (Electronic components are pasted on one side of the PCB board)

[0045] In this embodiment, since electronic components are pasted on one side of the PCB, steps 4 and 5 are omitted.

[0046] The key point of the present invention is: after printing solder paste and SMT process on both sides of the front and back, stick the electronic components on the designated position of the PCB panel, and then cut the PCB panel into several strip-shaped circuit boards. The two rows of pins of the connector are clamped to the corresponding pads on both sides of each PCB board on the strip circuit board, and the strip circuit board inserted with the connector is sent into a reflow soldering furnace for welding. Once reflow soldering, at this time, each electronic component and connector on the strip circuit board has been welded firmly with the PCB board, and finally, several USB TYPE-C modules are cut from the strip circuit board; since the present invention only has O...

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Abstract

The invention provides a production method of USB (Universal Serial Bus) TYPE-C modules. The method comprises the following steps: printing solder paste on the front and back surfaces of a circuit board and performing SMT, attaching an electronic component to the designated location of a PCB panel; after that, cutting the PCB panel into a plurality of strip circuit boards; clamping two rows of pins of a connector to corresponding bonding pads of both sides of each PCB panel on the strip circuit boards; putting a strip lath plugged with the connector into a reflow welding furnace for welding, and performing once reflow soldering, and at the moment, various electronic components and connectors on the strip lath have been firmly welded with the PCB panel; and finally, cutting from the strip lath to obtain a plurality of USB TYPE-C modules. Since the production method of the USB TYPE-C modules provided by the invention only has once reflow soldering step, so that the technical problems of large probability of making melted and cured soldering tin melted, solder wicked and pseudo soldered again and rough melting points do not exist. The production method of the invention achieves the effects of most saving material and good welding quality through the panel and panel-cutting ways.

Description

technical field [0001] The invention relates to a production method of a USB TYPE-C module. Background technique [0002] USB (Universal Serial Bus, Universal Serial Bus) is a new interface technology applied in the computer field. The USB interface has the characteristics of faster transmission speed, support for hot plugging and connection of multiple devices. At present, it has been widely used in various external devices. There are three types of USB interfaces: USB1.1, USB2.0 and USB3.0. Theoretically, the transmission speed of USB1.1 can reach 12Mbps, while USB2.0 can reach the speed of 480Mbps, and can be backward compatible with USB1.1. As early as 1995, there were already personal computers with USB ports, but due to the lack of software and hardware support, the USB ports of these personal computers were all idle. After 1998, with Microsoft's built-in support module for the USB interface in Windows 98, and the increasing number of USB devices, the USB interface...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01R43/02H01R43/20
CPCH01R43/0256H01R43/205
Inventor 谭小波杨延航
Owner 深圳市宇隆宏天科技有限公司