Manufacturing method of shielded connector

Abstract

The invention discloses a manufacturing method of a shielded connector. The manufacturing method comprises the steps of: S1,providing a body having an upper surface, a lower surface, a signal accommodating hole and a grounding accommodating hole; S2, providing a metal layer, which is plated on the upper surface of the body and the inner walls of the signal accommodating hole and the grounding accommodating hole; S3, removing the metal layer which circles around the signal accommodating hole on the upper surface by means of laser to form an isolation region surrounding the signal accommodating hole, and separating the metal layer into a first metal layer and a second metal layer; S4, electrifying the first metal layer on the upper surface for performing electroplating treatment, so as to increase the thickness of the first metal layer on the upper surface, wherein the second metal layer cannot be thickened since the second metal layer is electrically isolated from the first metal layer; S5, removing the metal layer by the thickness of the second metal layer, thus the second metal layer is completely removed and the thickness of the first metal layer is reduced; S6, and providing a signal terminal and a grounding terminal, and arranging the signal terminal into the signal accommodating hole and arranging the grounding terminal into the grounding accommodating hole correspondingly.

Description

technical field [0001] The invention relates to a manufacturing method of a shielding connector, in particular to a manufacturing method capable of ensuring a good shielding effect of the shielding connector. Background technique [0002] The Chinese patent with the patent number CN201310691784.2 discloses a shielded connector, which includes at least one body, each of which has an upper surface and a lower surface, and a plurality of signal signals penetrate from the upper surface to the lower surface. When manufacturing the storage tank and multiple ground storage tanks, the whole body is first plated with a conductive layer, so that the upper surface, the lower surface, the signal storage tank and the ground storage tank all have The conductive layer, and then use an etching tool to etch away the conductive layer adjacent to the periphery of each of the signal receiving grooves on the upper surface and the lower surface, so that the upper surface is adjacent to each of th...

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Problems solved by technology

[0003] However, the realization of the above-mentioned etching process must ensure that the upper surface and the lower surface must be flat planes. When the upper surface and the lower surface are not a flat surface, when the etching process is performed, due to the The surface is uneven, so that there is still a gap between the etching fixture and the upper surface and the lower surface. During the etching process, the etching solution easily enters the metal layer that we originally need to keep through the gap, and then the The metal layer that we originally need to keep is also etched away, which affects the processing and manufacturing of the body, thus affecting the good shielding effect of the shielded connector

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