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Copper plating solution and copper plating method

A copper plating solution and copper plating technology, applied in liquid chemical plating, coating, metal material coating process and other directions, can solve the problems of poor coating adhesion and achieve the effect of uniform adhesion

Active Publication Date: 2021-01-01
C UYEMURA & CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, even if plating is carried out by the usual pretreatment (activation treatment), the adhesion of the plating layer is poor.

Method used

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  • Copper plating solution and copper plating method
  • Copper plating solution and copper plating method
  • Copper plating solution and copper plating method

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no. 1 approach

[0025] The copper plating solution involved in the first embodiment includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, EDTA substituted derivatives, ethylenediamine derivatives and glycine; hydantoin and its substituted derivatives at least one of the The copper plating solution is used for replacing copper plating on an aluminum base material or an aluminum alloy base material. In this case, copper displacement plating is performed on a non-galvanized substrate that has not been galvanized. Since the ionization tendencies are different, the aluminum placed in the copper plating solution of this embodiment becomes aluminum ions and dissolves in the copper plating solution, and the copper ions are deposited on the surface of the aluminum substrate or the aluminum alloy substrate. Copper ions and aluminum ions in the plating solution use at least one of EDTA, EDTA substituted derivatives, ethylenediamine derivatives and glycine and ethylenediamine as co...

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Abstract

The invention provides a copper plating solution. The copper plating solution of the present invention comprises: water-soluble copper salt; Ethylenediamine; At least one of EDTA, EDTA's substituted derivatives, ethylenediamine derivatives and glycine; and hydantoin and its substituted derivatives at least one. And it is used for replacing copper plating on aluminum base material or aluminum alloy base material. Therefore, the copper plating solution provided by the present invention can easily form a copper plating layer closely bonded to the surface of aluminum or aluminum alloy without galvanizing treatment, and the cost is low.

Description

technical field [0001] The invention relates to a copper plating solution and a copper plating method. Background technique [0002] At present, plating technology has been widely used in various fields from daily necessities to high-tech products. The objects to be treated by plating also include various substances such as metals and plastics. Among these treated objects, aluminum and aluminum alloys are very easy to be oxidized. Even if the oxide film on the surface is removed by acid dipping, a new oxide film will be formed in the subsequent washing process. Therefore, even if plating is performed by a usual pretreatment (activation treatment), the adhesion of the plating layer is poor. Therefore, when aluminum or aluminum alloy is plated, zinc dipping treatment is generally used as a pretreatment. [0003] Zinc dipping treatment, ie, zinc replacement treatment, refers to the treatment of dissolving the oxide film of aluminum and depositing zinc on the exposed aluminum...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C23C18/40
CPCC23C18/40C23C18/54C25D3/38C25D5/022C25D5/44
Inventor 吉冈优子中山智晴山本久光
Owner C UYEMURA & CO LTD
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