Lateral-outlet photoelectric sending-receiving-function integrated SiP encapsulating structure and process method thereof

Abstract

The invention relates to a lateral-outlet photoelectric sending-receiving-function integrated SiP encapsulating structure and a process method thereof. The structure comprises a substrate (1), wherein an optical sender (2) and an optical receiver (3) are laminated to the substrate (1), metal shells (4) are arranged outside the optical sender (2) and the optical receiver (3) and comprise square shells (4.1), round pies (4.2) are arranged outside the square shells (4.1), and second lens (5) are arranged in the round pies (4.2); and a chip (6) and passive devices (7) are laminated to the substrate (1) outside the metal shells (4), and the metal shells (4), the chip (6) and the passive devices (7) are encapsulated with plastic materials (6). According to the structure, a sending module and a receiving module are integrated into an SIP encapsulating structure by virtue of metal shell parts, so that the multifarious process of existing products is reduced, the production efficiency is improved, and meanwhile, the external force resistance and impermeability of a product are improved.

Description

technical field [0001] The invention relates to a side-out type SiP packaging structure with integrated photoelectric transceiver function and a process method thereof, belonging to the technical field of semiconductor packaging. Background technique [0002] Optical fiber technology has become more and more popular, and photoelectric modules have been widely used. The current optoelectronic module is mainly assembled by receiving optical sub-assembly, transmitting optical sub-assembly, optical interface, internal circuit board, heat conducting frame and shell (see figure 1 ). Among them, the sending optical subassembly is to assemble the optical sending device on the sending side PCB. The optical sending device is generally composed of a laser (laser diode), a backlight tube (backlight detection tube), a thermistor, a TEC cooler, and an optical alignment mechanism. The components are integrated inside a metal shell; the receiving optical subassembly is to assemble the lig...

AI Technical Summary

Problems solved by technology

To complete a complete photoelectric transceiver module structure, it needs to be assembled one by one. The whole process has many procedures and the production efficiency is relatively low, and the anti-external force ability of the assembled photoelectric transceiver module structure is relatively poor. The assembled photoelectric transceiver module structure The airtightness is not good enough, and it is easy to be corroded by water vapor.

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