Lateral-outlet photoelectric sending-receiving-function integrated SiP encapsulating structure and process method thereof
A packaging structure, photoelectric transceiver technology, applied in the coupling of optical waveguide, etc., can solve the problems of poor resistance to external force, low production efficiency, and many processes, so as to enhance the ability of resistance to external force, avoid water vapor erosion, and improve production efficiency. Effect
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[0050] The present invention will be described in further detail below in conjunction with the embodiments of the drawings.
[0051] Such as figure 2 , image 3 As shown, a side-out SiP package structure with integrated optoelectronic transceiver functions in this embodiment includes a substrate 1 on which an optical transmitter 2 and an optical receiver 3 are attached, and the optical transmitter 2 includes a plurality of first copper blocks 2.1, and the backlight plate 2.2, the first thermistor 2.3, the laser 2.4, the first lens 2.5 and the isolator 2.6 are attached to the plurality of first copper blocks 2.1. The optical receiver 3 includes a plurality of second copper blocks 3.1 on which components such as a front amplifier IC3.3, a second thermistor 3.2 and a detector 3.4 are attached, and the laser 2.4 is connected to The first copper block 2.1 is connected by a metal wire 10, the front amplifier IC3.3 and the second copper block 3.1 are connected by a metal wire 10, and t...
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