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Machining device of cooling plate

A technology for processing devices and heat sinks, applied in positioning devices, metal processing equipment, metal processing machinery parts, etc., can solve problems such as low efficiency

Pending Publication Date: 2017-10-20
遵义市欣茂汇机电有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The present invention intends to provide a cooling plate processing device to solve the problem of low efficiency caused by the need to replace the positioning fixture for different sizes of cooling plates in the milling machine of the prior art.

Method used

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  • Machining device of cooling plate
  • Machining device of cooling plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] Example 1 is basically as attached Figure 1~2 Shown: a heat sink processing device of the present invention includes a milling machine worktable 1, a dust collection system, a milling cutter and two symmetrically arranged positioning fixtures 2. The positioning fixtures 2 are set on the milling machine workbench 1, passing 4 The screw mounts two positioning fixtures 2 on the milling machine workbench 1. The milling cutter is located on the upper part of the positioning fixture 2. The positioning fixture 2 includes a positioning seat and a clamping body. The positioning seat includes a positioning plate 201 and a seat body 202. The seat body 202 is set on The upper part of the positioning plate 201; the seat body 202 is provided with a sliding groove 203, an adjusting gear and an adjusting rack 204 meshing with the adjusting gear. The adjusting gear is provided with an adjusting handle 6 penetrating the seat body 202, and the seat body 202 is provided with prevention The...

Embodiment 2

[0022] The difference between the second embodiment and the first embodiment is only that the position where the L-shaped plate 205 is connected to the metal block is not provided with a buffer layer, but the two L-shaped plates 205 are connected by a spring.

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PUM

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Abstract

The invention discloses a machining device of a cooling plate. The machining device of the cooling plate comprises a milling machine workbench, a milling cutter and locating clamps. The locating clamps are located on the milling machine workbench and each comprises a locating seat and a clamping body. Each locating seat comprises a locating plate and a seat body, wherein the seat body is arranged on the upper portion of the locating plate, and the locating plate is arranged on the milling machine workbench. A sliding groove, an adjusting gear and adjusting racks meshed with the adjusting gear are arranged in each seat body. The adjusting racks slide in the sliding grooves. The adjusting racks of each seat body are arranged on the two opposite sides of the corresponding adjusting gear. Each clamping body comprises two opposite L-shaped plates connected with the corresponding seat body in a sliding manner. The two L-shaped plate of each clamping body are connected with the corresponding adjusting racks correspondingly. According to the machining device of the cooling plate, the clamping body with an adjustable interval is designed, the clamping body is composed of the two L-shaped plates which are adjusted through the adjusting gear and the adjusting racks, through rotation of the adjusting gears, the clamping dimension of each clamping body can be adjusted, and the machining demand for metal cooling plates of multiple dimensions can be met.

Description

Technical field [0001] The invention relates to the technical field of circuit board heat dissipation, in particular to a processing device for a heat dissipation plate. Background technique [0002] As the volume of today's technology products tends to be light, thin and short, the components in technology products are also improving in the direction of miniaturization. For common electronic devices such as notebook computers, many electronic components and chips with different functions are arranged on the circuit board configuration in the electronic device under the limited volume of the electronic device, so as to achieve more electronic devices. The purpose of the function. The volume of electronic devices continues to shrink, but the thermal power of the internal electronic components and chips of the electronic device continues to rise. Therefore, in order to allow the electronic components and chips to quickly dissipate heat, heat sinks are usually installed on the elec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23Q3/06
CPCB23Q3/061
Inventor 梁忠云
Owner 遵义市欣茂汇机电有限公司