Chip-level integrated microfluid heat dissipation module and preparation method thereof
A heat dissipation module and microfluidic technology, applied in the field of microelectronics and microsystems, can solve problems such as inability to cope with high-power microelectronic systems, achieve the effects of solving high-power heat dissipation problems, improving heat transfer efficiency, and improving heat conduction efficiency
Active Publication Date: 2017-10-24
NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD
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Problems solved by technology
Such a heat dissipation architecture cannot cope with high power (>100W) and ultra-high heat flux (>1kw / cm2) in principle 2 ) microelectronic system
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[0020] The technical solution of the present invention will be described in detail below in conjunction with the accompanying drawings.
[0021] combine Figure 1-Figure 5 , a chip-level integrated microfluidic heat dissipation module, comprising a lower silicon-based microfluidic topological structure 12, an upper silicon-based microfluidic topological structure 11, and a power chip interface;
[0022] The lower silicon-based microfluidic topological structure 12 and the upper silicon-based microfluidic topological structure 11 are stacked, and the upper surface of the upper silicon-based microfluidic topological structure 11 has a groove, and a metal connection layer is arranged around the groove as a power Chip interface; cooling liquid inlet 14 and cooling liquid outlet 17 are arranged on both sides of the groove, and the lower silicon-based microfluidic topology 12 is provided with a lower cooling liquid diversion channel 18 communicating with the cooling liquid inlet 14 ...
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The present invention relates to a chip-level integrated microfluid heat dissipation module and a preparation method thereof. The heat dissipation module comprises a lower-layer silicon-based microfluid topological structure, an upper-layer silicon-based microfluid topological structure and a power chip interface; the lower-layer silicon-based microfluid topological structure horizontally guides and distributes a cooling liquid to a position below a micro spraying hole array, and collects and guides waste liquid which has exchanged heat with a power chip; the upper-layer silicon-based microfluid topological structure provides interfaces through which the cooling liquid can flow into and flow out from the upper-layer silicon-based microfluid topological structure; the upper-layer silicon-based microfluid topological structure vertically guides and distributes the cooling liquid in the lower-layer silicon-based microfluid topological structure to the bottom of the power chip which emits heat; and waste liquid which has completed heat exchange flows to the lower-layer silicon-based microfluid topological structure through micro-channels around. According to the chip-level integrated microfluid heat dissipation module and the preparation method thereof of the invention, the cooling liquid can directly arrive at the bottom of the chip through the micro spraying hole array, and in this process, no intermediate layers increase extra thermal resistance, and therefore, heat dissipation efficiency can be improved; heat dissipation can be performed on local hot spots of a system, and therefore, the complexity and cost of a heat dissipation system can be decreased.
Description
technical field [0001] The invention belongs to the technical field of microelectronics and microsystems, and in particular relates to a chip-level integrated microfluid cooling module and a preparation method thereof. Background technique [0002] In the future, microelectronic systems are developing in the direction of integration with higher performance, smaller size and more functions. System integration is increasing day by day, followed by a sharp increase in system power density. High power output will inevitably lead to the generation of large heat. Without reliable thermal management measures, the continuous accumulation of heat can cause the system operating temperature to rise sharply, which can negatively affect the system performance, reliability and lifetime. Compound semiconductor active devices such as lasers, LEDs, and MMICs are the main source of system heat. The common features of these devices are small size, high heat generation, super large heat flux...
Claims
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IPC IPC(8): H01L21/48H01L23/473B81B1/00B81B7/04B81C1/00B81C3/00
Inventor 黄旼贾世星朱健
Owner NO 55 INST CHINA ELECTRONIC SCI & TECHNOLOGYGROUP CO LTD