Layout wiring structure and wiring method for improving signal SI quality

A wiring structure and wiring method technology, applied in the reduction of crosstalk/noise/electromagnetic interference (, printed circuits, instruments, etc., can solve the problems of complex layout wiring, differences in SI signal quality, and high development costs, and improve SI signal quality. , Improve the SI signal quality, the effect of small crosstalk

Inactive Publication Date: 2017-11-03
ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a Layout wiring structure and a wiring method that improve signal SI quality, which is used to solve the problem of complex layout wiring, high development costs, and differences in the SI signal quality of two differential lines at the receiving end of the device signal in PCB design. The problem

Method used

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  • Layout wiring structure and wiring method for improving signal SI quality
  • Layout wiring structure and wiring method for improving signal SI quality
  • Layout wiring structure and wiring method for improving signal SI quality

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Embodiment Construction

[0027] In order to clearly illustrate the technical features of the present solution, the present invention will be described in detail below through specific implementation methods and in conjunction with the accompanying drawings. The following disclosure provides many different embodiments or examples for implementing different structures of the present invention. To simplify the disclosure of the present invention, components and arrangements of specific examples are described below. Furthermore, the present invention may repeat reference numerals and / or letters in different instances. This repetition is for the purpose of simplicity and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. It should be noted that components illustrated in the figures are not necessarily drawn to scale. Descriptions of well-known components and processing techniques and processes are omitted herein to avoid unnecessarily lim...

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Abstract

The invention discloses a Layout wiring structure for improving signal SI quality. Each of positive and negative differential routes in a PCB comprises a plurality of D1 sections, a plurality of D2 sections and a plurality of D3 sections; the D1 sections and the D2 sections of any differential route are arranged in parallel in a staggered manner; and any adjacent D1 and D2 sections of any differential route are connected through the D3 section. The invention furthermore discloses a Layout wiring method for improving the signal SI quality. The positive and negative differential routes parallel to each other on the PCB are subjected to wiring in a longitudinal repeated shift mode. The signal transmission delays on the positive and negative differential routes in a differential coupling pair are compensated for enabling the delays of signals, reaching a receiving end of a device, on the two routes to be same, so that the risk of differential mode to common mode noises is lowered and the signal SI quality of high-speed signals during long-distance transmission is improved.

Description

technical field [0001] The invention relates to the technical field of PCB design, in particular to a Layout wiring structure and a wiring method for improving signal SI quality. Background technique [0002] In the current motherboard design, in order to reduce the influence of the high-speed wiring signal transmission quality caused by the structure of the board, the usual way is to replace the board structure and use an open-woven cloth board, that is, add another layer of pressure to the glass cloth cluster of the board The process makes the glass cloth clusters expand to the surroundings, thereby eliminating the gap between the vertical and horizontal intersecting glass cloths, so as to balance the DK value difference of each point on the plate. [0003] Another way is to use the traditional board. When designing the PCB, for the high-speed wiring, the whole board uses a 10-degree diagonal line for wiring, so as to balance the DK difference felt on the P and N lines of ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
CPCG06F30/392G06F30/394G06F2115/12G06F2119/10H05K1/0245H05K1/0366H05K2201/029H05K2201/09236H05K2201/09263H05K1/0216
Inventor 武宁
Owner ZHENGZHOU YUNHAI INFORMATION TECH CO LTD
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