Optical receiving components and optical modules
A light-receiving component and electrical connection technology, applied in the field of optical communication, can solve the problems of transimpedance amplifiers without pins, increased cost, and increased equivalent resistance of equivalent capacitance between boards, etc.
Active Publication Date: 2020-10-27
INNOLIGHT TECHNOLOGY (SUZHOU) LTD
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Problems solved by technology
However, since the capacitance of the PD chip is reduced, the cost will increase a lot. Therefore, the method of increasing the bias voltage VPD is generally used at present.
[0003] However, the transimpedance amplifier (TIA chip) has no pins to provide high-voltage bias, so it can only be biased externally, but in the traditional way, when the communication speed is fast or the frequency is high, the equivalent capacitance between the boards, etc. The effective inductance and equivalent resistance will increase
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[0022] The present application will be described in detail below in conjunction with various implementations shown in the accompanying drawings. However, these embodiments do not limit the present application, and any structural or functional changes made by those skilled in the art according to these embodiments are included in the protection scope of the present application.
[0023] In each drawing of the present application, some dimensions of structures or parts are exaggerated relative to other structures or parts for the convenience of illustration, and therefore, are only used to illustrate the basic structure of the subject matter of the present application.
[0024] The terms used herein to denote relative spatial positions such as "upper", "above", "under", "under", etc. are for convenience of description to describe the relative position of one element or feature relative to another as shown in the drawings. Relationships of units or features. The terms of spatial...
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The invention discloses an optical receiving component and an optical module. The optical receiving component is electrically connected with a high-voltage power source and comprises a photoelectric detector, a trans-impedance amplifier and a high-voltage capacitor; the photoelectric detector, the trans-impedance amplifier and the high-voltage capacitor are electrically connected with each other; the photoelectric detector is electrically connected with the high-voltage power source; the high-voltage capacitor isolates the trans-impedance amplifier from the high-voltage power source; and the trans-impedance amplifier is electrically connected with the photoelectric detector through the high-voltage capacitor. In the technical scheme, as the high-voltage capacitor isolates the trans-impedance amplifier from the high-voltage power source, the trans-impedance amplifier can work in the presence of the high-voltage power source and can be assembled together with the photoelectric detector, and the signal quality is improved.
Description
technical field [0001] The application belongs to the technical field of optical communication, and in particular relates to an optical receiving component and an optical module. Background technique [0002] At present, in the optical communication module, the light receiving components include PD chips (photodetectors) and TIA chips (transimpedance amplifiers). Currently, there are two commonly used PD chips, APD (avalanche photodiode) and PIN (photodiode). The photodetector and the transimpedance amplifier are generally connected by gold wires. With the increase of the optical communication rate, the corresponding packaging bandwidth also needs to be increased, and the capacitance of the PD chip should also be reduced. Therefore, fast response can be achieved in two ways: 1. Reduce the internal capacitance of the PD chip; 2. Increase the bias voltage VPD. However, since the cost of the PD chip will increase a lot after the capacitance of the PD chip is reduced, a method...
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IPC IPC(8): H04B10/69H04B10/40
CPCH04B10/40H04B10/69
Inventor 汪振中王祥忠
Owner INNOLIGHT TECHNOLOGY (SUZHOU) LTD