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Composite multilayer circuit board

A multi-layer circuit board and composite technology, which is applied in the direction of printed circuit, printed circuit, printed circuit components, etc., can solve the problems of insufficient electromagnetic anti-interference ability of multi-layer circuit board, so as to increase anti-interference ability, increase shielding, Effects of Enhanced EMC Capabilities

Active Publication Date: 2019-12-17
CHANGSHU MUTUAL TEK CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] However, in many special occasions, some areas need to use hard boards, and some areas need flexible soft boards. At the same time, there are electrical connections between the two parts of the area, and even the circuit boards need to be arranged in a specific shape according to a specific site. The current The circuit board is not competent, and the electromagnetic anti-interference ability of the multi-layer circuit board is often insufficient in this case.

Method used

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  • Composite multilayer circuit board
  • Composite multilayer circuit board
  • Composite multilayer circuit board

Examples

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Embodiment Construction

[0031] The present invention will be further described in detail through the examples below, so that those skilled in the art can implement it with reference to the description.

[0032] It should be understood that terms such as "having", "comprising" and "including" used herein do not exclude the presence or addition of one or more other elements or combinations thereof.

[0033] Such as figure 1 As shown, an embodiment is a composite multilayer circuit board, including: a substrate, which is composed of a soft proton substrate 100 and a number of hard proton substrates 200, and the hard proton substrates 200 are arranged at intervals On the soft proton substrate 100, the surface of the soft proton substrate 100 not covered by the hard proton substrate 200 is in the same plane as the outer surface of the hard proton substrate 200 on the same side; several signal layers 300, respectively Arranged in parallel on the upper and lower surfaces of the substrate; two ground layers...

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PUM

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Abstract

The scheme relates to a composite multi-layer circuit board, comprising a substrate, a plurality of signal layers, two grounding layers and a plurality of isolation layers, wherein the substrate is formed by combining a soft proton substrate and a plurality of hard proton substrates, the hard proton substrates are arranged on the soft proton substrate at intervals, and the surface of the soft proton substrate that is not covered by the hard proton substrates is located in the same plane with the outer surfaces of the hard proton substrates at the same side; the plurality of signal layers are separately arranged on the upper and lower surfaces of the substrate in parallel; the two grounding layers are separately arranged outside the outermost signal layer in parallel; and the plurality of isolation layers are arranged between the adjacent signal layers in parallel, and the isolation layers are also arranged between the adjacent grounding layer and signal layer in parallel. The composite multi-layer circuit board can meet the special requirements of special situations on the shape of the circuit board, and also has stronger electromagnetic anti-interference capability.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a composite multilayer circuit board. Background technique [0002] Printed boards have developed from single-layer to double-sided, multi-layer and flexible, and still maintain their own development trends. Due to the continuous development in the direction of high precision, high density and high reliability, continuous reduction in size, cost reduction and performance improvement, printed boards still maintain strong vitality in the development of future electronic equipment. [0003] However, in many special occasions, some areas need to use hard boards, and some areas need flexible soft boards. At the same time, there are electrical connections between the two parts of the area, and even the circuit boards need to be arranged in a specific shape according to a specific site. The current The circuit board is not competent, and the electromagnetic anti-interference ability of th...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K1/14
CPCH05K1/147H05K2201/093
Inventor 陈旭东邱士于
Owner CHANGSHU MUTUAL TEK CO LTD
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