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Circuit board depth control etching method

A deep etching, circuit board technology, used in chemical/electrolytic methods to remove conductive materials, printed circuits, printed circuits, etc., can solve problems such as inability to manufacture and product damage

Inactive Publication Date: 2017-11-07
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In order to reduce the interference of parasitic capacitance, it is necessary to remove the excess pad on the back of the impedance line. The traditional method is to use the back drilling process to remove the excess hole copper in the pad and the hole connected to the impedance line. However, for small aperture, dielectric layer In the thinner case, the back drilling process is easy to cause damage to the product, so it cannot be manufactured. Therefore, it is necessary to develop a new manufacturing process to remove redundant pads to meet customer needs.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0014] The present invention will be further described below in conjunction with specific examples.

[0015] During specific implementation, the circuit board is firstly subjected to pre-process, drilling, electroplating and resin plugging; the hole on the circuit board correspondingly connected to the impedance line is used as the hole for controlling depth etching, and the back side of the impedance line on the circuit board is used as the control hole. Deep etched surface;

[0016] When plugging the holes with resin, the plug holes are etched deep on the controlled surface, and the concavity is less than or equal to 3 mils to ensure that there are no air bubbles and prevent the dry film from wrinkling when the outer layer is patterned later.

[0017] Resin grinding is carried out after the resin plug hole is completed. The linear speed of the grinding plate for resin grinding is 1.5±0.5m / min; the current of the grinding plate is 3.0A, and the grinding effect is confirmed af...

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PUM

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Abstract

The invention relates to a circuit board depth control etching method. According to the depth control etching method provided by the invention, excess pad on the back of an impedance line and excess hole copper in wall of a hole connected with the impedance line can be effectively removed; the shortcomings of a backdrilling process are compensated; and the method is not limited by the aperture and the dielectric layer thickness.

Description

technical field [0001] The invention relates to the field of circuit board production, in particular to a method for controlled deep etching of a circuit board. Background technique [0002] With the development of the communication industry to the 5G era, the communication signal is enhanced and the communication speed is accelerated. The corresponding server PCB must also meet the requirements of high frequency and high speed. In order to reduce the interference of parasitic capacitance, it is necessary to remove the excess pad on the back of the impedance line. The traditional method is to use the back drilling process to remove the excess hole copper in the pad and the hole connected to the impedance line. However, for small aperture, dielectric layer In the thinner case, the back-drilling process is easy to cause damage to the product, so it cannot be manufactured. Therefore, it is necessary to develop a new manufacturing process to remove redundant pads to meet custome...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/06H05K3/00
CPCH05K3/0094H05K3/06H05K2201/0959
Inventor 蒋华何艳球张亚锋施世坤
Owner VICTORY GIANT TECH HUIZHOU CO LTD