LED module and method for pouring glue on surface of LED module

An LED module and glue filling technology, which is applied to devices and coatings for coating liquid on the surface, can solve the problems of high cost, cumbersome process, unsatisfactory glue filling process effect, etc., and achieves low cost and simple method. Line, smooth surface effect

Active Publication Date: 2017-11-10
深圳市艾森视讯科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to overcome the above-mentioned deficiencies of the prior art, and provide an LED module and its surface glue filling meth

Method used

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  • LED module and method for pouring glue on surface of LED module
  • LED module and method for pouring glue on surface of LED module
  • LED module and method for pouring glue on surface of LED module

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0058] Example 1

[0059] A potting mold for potting the light-emitting diodes 9 on the surface of the LED module 1. The potting mold has a structure such as figure 1 As shown, it includes a first mold part 2 and a second mold part 3 arranged up and down. The LED module 1 is fixed to the bottom of the first mold part 2, and the top of the second mold part 3 is provided with a cavity for holding glue 16 17. The bottom surface of the cavity 17 is a horizontal plane; the left and right sides of the first mold part 2 are each provided with a support plate 8, and the side of the LED module 1 is provided with horizontal beads (not marked). The four corners of the LED module 1 are provided with four first threaded holes 14, and the four corners of the first mold part 2 are provided with four mounting holes 4 corresponding to the positions of the first threaded holes 14; Furthermore, the LED module 1 passes through the mounting hole 4 with four bolts 6 to fit with the first threaded hole...

Example Embodiment

[0060] Example 2

[0061] A potting mold for potting the light-emitting diodes 9 on the surface of the LED module 1. The potting mold has a structure such as figure 2 As shown, it includes a first mold part 2 and a second mold part 3 arranged up and down. The LED module 1 is fixed to the bottom of the first mold part 2, and the top of the second mold part 3 is provided with a cavity for holding glue 16 17. The bottom surface of the cavity 17 is a horizontal plane; the left and right sides of the first mold part 2 are each provided with a support plate 8, and the side of the LED module 1 is provided with horizontal beads (not marked). Four second threaded holes 15 are provided in the middle of the four sides of the LED module 1, each second threaded hole 15 is screwed with a magnet 7, and the middle of the four sides of the first mold part 2 is provided with a position corresponding to each magnet 7 The four magnetic parts 5; the four magnetic parts 5 and the four magnets 7 are c...

Example Embodiment

[0062] Example 3

[0063] A method for pouring glue on the surface of an LED module includes the following steps:

[0064] S31: Provide the LED module 1, the glue 16 and the glue potting mold in the embodiment 1 and the embodiment 2.

[0065] S32: Fix the LED module 1 on the first mold part 2 so that the light-emitting diode 9 on the surface of the LED module 1 and the second mold part 3 are arranged opposite to each other, and the glue 16 is poured into the cavity 17.

[0066] S33: The first mold part 2 and the second mold part 3 are matched up and down with each other so that the light emitting diode 9 on the surface of the LED module 1 is immersed in the glue 16 downward, and then vacuum defoaming is performed.

[0067] S34: After the glue 16 is solidified, demold the LED module 1 after the glue is poured.

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Abstract

The invention belongs to the technical field of glue pouring, and particularly relates to an LED module and a method for pouring glue on the surface of the LED module. The method for pouring the glue on the surface of the LED module comprises the steps that the LED module, the glue and a glue pouring mold are provided, wherein the glue pouring mold comprises a first mold component and a second mold component which are arranged up and down, a cavity is formed in the top of the second mold component, and the bottom surface of the cavity is a horizon plane; the LED module is fixed to the first mold component, light-emitting diodes on the surface of the LED module are made opposite to the second mold component, and the glue is poured into the mold cavity; the first mold component and the second mold component are matched up and down, so that the light-emitting diodes on the surface of the LED module are made to be downwards immersed in the glue; and after the glue is solidified, the LED module is separated from the mold. According to the LED module and the method for pouring the glue on the surface of the LED module, the surface of a glue layer formed after glue pouring of the LED module is made smooth and flat, the light-emitting diodes are better protected, and polishing is not needed after glue pouring.

Description

technical field [0001] The invention belongs to the technical field of glue filling, and in particular relates to an LED module and a surface glue filling method thereof. Background technique [0002] The LED module is a product formed by arranging light emitting diodes (Light Emitting Diode, LED) together according to certain rules and then packaging them together, and adding some waterproof treatment processes. LED module is a widely used product in LED products. There are also great differences in structure and electronics. The simple one is to use a circuit board and shell equipped with LEDs to form an LED module. The more complicated one is There are also some controllers, constant current sources and related heat dissipation devices, which make the LED life and luminous intensity better. [0003] Since the light-emitting diodes on the existing LED modules are relatively fragile, there are related LED modules on the market that need to be protected by pouring glue on t...

Claims

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Application Information

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IPC IPC(8): B05C3/02B05C13/02B05C11/11B05C11/02
CPCB05C3/02B05C11/02B05C11/11B05C13/02
Inventor 李付民杨承华
Owner 深圳市艾森视讯科技有限公司
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