Buffering fixing device for radiating pieces and plug pins

Abstract

The invention discloses a caching and fixing device for cooling fins and pins. Located on the same vertical straight line, heat sinks are arranged in the feed magazine of the heat sink, and the two ends of the connecting rod are symmetrically equipped with a transplanting mechanism and a binding mechanism. The device of the present invention has high degree of automation, accurate positioning of the cooling fins, and buffer function in the fixing process between the cooling fins and pins, which reduces the time for waiting for the cooling fins to be in place, and has high working efficiency.

Description

technical field [0001] The invention relates to the technical field of heat sink preparation devices, in particular to a buffering and fixing device for heat sinks and pins. Background technique [0002] Electronic products will generate more heat during use. In order to protect and ensure the performance and service life of components in electronic products, heat sinks are generally added to electronic products, and heat sinks are usually fixed by pins. The space occupied by the small heat sink in electronic products, there will be a small fixed piece (that is, the pin) on the heat sink, but because the fixed piece is small, when it is integrally formed with the heat sink, the pin will be damaged or fall off due to depression, and the heat sink The defect rate is high, and the position of the pins cannot be adjusted at any time because of actual production needs, and the flexibility of the pins is not high. Therefore, the pins are generally not integrally formed with the he...

AI Technical Summary

Problems solved by technology

[0002] Electronic products will generate more heat during use. In order to protect and ensure the performance and service life of components in electronic products, heat sinks are generally added to electronic products, and heat sinks are usually fixed by pins. The space occupied by the small heat sink in electronic products, there will be a small fixed piece (that is, the pin) on the heat sink, but because the fixed piece is small, when it is integrally formed with the heat sink, the pin is depressed and damaged or falls off. The defect rate is high, and the position of the pins cannot be adjusted at any time because of actual production needs, and the flexibility of the pins is not high. Therefore, the pins are generally not integrally formed with the heat sink, but the pins and the heat sink are regulated in a later stage.

[0003] However, in the prior art, the pins are small, and it is not easy to fix the heat sink and the pins. Generally, the heat sink rivets and pins are punched out on the heat sink first, and then the pins and the heat sink are bonded manually before stamping and fixing. , the degree of automation is low, which affects production efficiency, and because it is manually fixed, the fixed position is often inaccurate, unstable, and easy to fall off, which has a negative impact on the subsequent fixing of heat sinks

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