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Method for Improving the Molar Phenomenon of Stitching Exposure

A phenomenon and sub-exposure technology, which is applied in microlithography exposure equipment, photolithography exposure equipment, optics, etc., can solve the problems of splicing mura, uneven brightness at splicing places, etc., and achieve the effect of improving quality and weakening the effect of deterioration

Active Publication Date: 2020-03-10
TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The invention provides a method for improving the splicing exposure Mura phenomenon, which is used to solve the technical problems of uneven brightness at the splicing place and splicing Mura in the prior art

Method used

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  • Method for Improving the Molar Phenomenon of Stitching Exposure
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  • Method for Improving the Molar Phenomenon of Stitching Exposure

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Embodiment Construction

[0034] The present invention will be further described below in conjunction with accompanying drawing.

[0035] Such as figure 1 As shown, the present invention provides a method for improving the molar phenomenon of splicing exposure, which includes the steps of obtaining a substrate with a black matrix with a first mask, that is, the first manufacturing process (BM), and obtaining a black matrix with a second mask. The step of the substrate with the color group unit, that is, the second process (R / G / B) and the step of obtaining the substrate with the spacer with the third mask, that is, the third process (PS), wherein the first mask Areas of exposure regions on the stencil, the second mask and the third mask are all different.

[0036] In the prior art, since the splicing position on the substrate is the same in each process, the splicing Mura will be further aggravated and deteriorated after each process at the splicing position at the same position, so that the splicing M...

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PUM

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Abstract

The invention relates to a method for improving stitching exposure Mura and relates to the manufacturing field of display panels. The method solves the technical problem that the prior art produces uneven brightness of the joint and stitching Mura. The method comprises forming a substrate having a black matrix on a first mask, forming a substrate having a color cell unit on a second mask and forming a substrate having a spacer on a third mask. The different masks are used in different processes and the areas of the exposed areas on the first mask, the second mask and the third mask are different so that positions of joints of the substrates are different in different processes and thus the abnormal exposure amount at the stitching joint is reduced, stitching Mura deterioration caused by processes is reduced and the quality of the panel stitching joint is improved.

Description

technical field [0001] The invention relates to the field of manufacturing optical display panels, in particular to a method for improving the Mural phenomenon of splicing exposure. Background technique [0002] With the rapid development of various displays, customers have higher and higher requirements for the size of the panel, and the size of the display is also getting larger. In order to reduce the production cost, the size of the mask (Mask) required for the production of the panel is still used Smaller size (that is, the area of ​​the effective exposure area on the mask is smaller than the display area of ​​the display), in order to obtain a larger-sized surface change, the method of splicing and exposing the mask is used to prepare a larger-sized panel. [0003] However, in the actual production process, the precision of the exposure machine used in the color filter process (Color Filter, CF) is low. Problems such as a small amount of repeated exposure will cause t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G03F7/20
CPCG03F7/70283G03F7/70475
Inventor 雍玮娜徐向阳
Owner TCL CHINA STAR OPTOELECTRONICS TECH CO LTD
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