Transparent conductive sheet, touch panel module, and touch panel device
A transparent conductive, thin plate technology, used in electrical digital data processing, film/sheet adhesives, instruments, etc., can solve problems such as disconnection or short circuit, and achieve the effect of suppressing disconnection or short circuit
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Embodiment 1
[0144]With respect to polymer A1: 100 parts by mass, 0.3 parts by mass of trimethylolpropane-added toluene diisocyanate (Coronate L: manufactured by Nippon Polyurethane Industry Co., Ltd.) was added as an isocyanate crosslinking agent, and 1 part by mass of Zeolite (silicon-aluminum ratio = 18) was synthesized as a migration inhibitor, and defoaming was performed while mixing to obtain a coating liquid containing polymer A1. Next, the coating solution containing the polymer A1 was coated on a support (polyethylene terephthalate (PET) film with a thickness of 100 μm) so that the thickness after drying was 50 μm, and dried. Then, a PET film (thickness: 25 μm) subjected to release treatment on the coated surface was pasted to obtain a support having an adhesive layer.
[0145] Next, a support having a conductive layer formed of silver nanowires in a pattern shape of (line width, interval)=(10 μm, 190 μm), and a support with an adhesive after peeling off the PET film were peeled. ...
Embodiment 2～ Embodiment 30、 comparative example 1～ comparative example 22
[0147] A transparent conductive sheet was obtained in the same manner as in Example 1, except that the adhesive component for forming the adhesive layer and the pattern shape of the conductive layer were changed to those shown in Table 2 and Table 3.
reference example 1
[0149] An ITO film with a thickness of 200 nm was formed on the surface of an alkali-free glass substrate by a sputtering method. Next, after forming a resist film on this ITO film, using a figure 2 The photomask of the reversed shape of the pattern shown above exposes and develops the resist film to form a pattern on the resist film. Next, the glass substrate having the ITO film on which the patterned resist film was formed is etched using an etchant, and then the remaining resist film on the ITO film is removed with a resist stripper. Thus, it is obtained that the figure 2 The pattern shape shown (line width: 20 μm, space: 180 μm) is a glass substrate with a conductive layer made of an ITO film.
[0150] Next, instead of the support having a conductive layer in Example 1, the above-mentioned glass substrate having a conductive layer composed of an ITO film was used to bond to form a laminate, and then the substrate with an adhesive was mounted using a roller. One side o...
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