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A heat dissipation base material for a desktop computer motherboard
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A desktop computer and motherboard technology, applied in computing, applications, home appliances, etc., can solve problems such as poor heat dissipation of desktop computer motherboards, and achieve the effect of ensuring mechanical strength and improving success rate.
Active Publication Date: 2020-08-21
台州蓝鲸清洗机械股份有限公司
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[0006] In order to solve the problem of poor heat dissipation of existing desktop computer motherboards, the invention provides a heat dissipation substrate for desktop computer motherboards. The heat dissipation substrate uses a porous ceramic substrate as a base, and then an epoxy resin layer and Metal layer, because the porous ceramic substrate is densely covered with mesh heat dissipation channels, which greatly enhances the heat dissipation performance of the substrate
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preparation example Construction
[0077] The preparation method of described epoxy resin layer 2 comprises the following steps:
[0078] 1) Prepare modified nano-silica and modified silica sol respectively for subsequent use;
[0079] The modified nano-silica is obtained by mixing commercially available nano-silica and its weight 3-5% surface modifier II, and the surface modifier II consists of barium hydroxide, sodium carbonate and KH550 in a weight ratio of 3-5%. Mixed in the ratio of 4:1-2:30;
[0080] The modified silica sol is obtained by sequentially adding 2-3% silica sol weight silica powder, 1-2% silica sol weight potassium hexatitanate whiskers and 0.8-1% silica sol weight acetic acid to the commercially available silica sol sodium, and then stirred the resulting mixture at 70-80°C for 1-2h;
[0081] 2) Weigh each component according to the above ratio, then melt the bisphenol A epoxy resin, then add the weighed bisphenol F epoxy resin and aliphatic epoxy resin to it in turn, stir until completely ...
Embodiment 1
[0086] 1. Porous ceramic substrate 1
[0087] The porous ceramic substrate 1 is made by firing the main material, a pore-forming agent with a weight of 6% of the main material, an additive with a weight of 3% of the main material, and an aluminum fiber wire with a weight of 12% of the main material and a diameter of no more than 1mm. According to the weight ratio, The main material is composed of 16 parts of calcined kaolin, 10 parts of quartz sand, 4 parts of red mud and 6 parts of alumina micropowder, and the pore forming agent is composed of 8 parts of silicon carbide, 1 part of potassium permanganate, 4 parts of 1 part of kyanite powder and 2 parts of spodumene powder are mixed, and the admixture consists of 4 parts of borax, 2 parts of magnesium oxide, 2 parts of calcium oxide, 1 part of modified calcium sulfate whisker and 3 parts of modified It is formed by mixing silicon micropowder; its preparation method comprises the following steps:
[0088] 1) Prepare modified ca...
Embodiment 2
[0115] 1. Porous ceramic substrate 1
[0116] The porous ceramic substrate 1 is made by firing the main material, a pore forming agent with a weight of 8% of the main material, an additive with a weight of 5% of the main material, and an aluminum fiber wire with a weight of 16% of the main material and a diameter of no more than 1mm. According to the weight ratio, The main material is composed of 18 parts of calcined kaolin, 12 parts of quartz sand, 6 parts of red mud and 8 parts of alumina micropowder, and the pore forming agent consists of 9 parts of silicon carbide, 2 parts of potassium permanganate, 5 parts of 6 parts of kyanite powder and 3 parts of spodumene powder, the admixture consists of 6 parts of borax, 3 parts of magnesium oxide, 3 parts of calcium oxide, 2 parts of modified calcium sulfate whiskers and 4 parts of modified It is formed by mixing silicon micropowder; its preparation method comprises the following steps:
[0117] 1) Prepare modified calcium sulfate...
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Abstract
The invention discloses a heat dissipation base material used for desk computer main boards, and belongs to the field of computers. The base material comprises a porous ceramic base board, and epoxy resin layers which are adhered to the upper and lower surfaces of the porous ceramic base board and a metal layer which is adhered to the surface of the epoxy resin layer at one side; and a plurality of vertical through holes and oblique through holes are distributed in the porous ceramic base board, wherein the vertical through holes run through the upper and lower surfaces of the porous ceramic base board, the oblique through holes are blind holes, and the oblique through holes obliquely extends upwards from the edges of the porous ceramic base board to the interior of the porous ceramic base board, the vertical through holes communicate with the oblique through holes, and therefore net-shaped heat dissipation channels are formed in the porous ceramic base board. The heat dissipation base material provided in the invention uses the porous ceramic base board as a substrate, then the epoxy resin layers and the metal layer are arranged on the porous ceramic base board, the net-shaped heat dissipation channels are densely distributed in the porous ceramic base board, and therefore heat dissipation properties of the base material are greatly increased.
Description
technical field [0001] The invention relates to a desktop computer motherboard in the computer field, in particular to a heat dissipation base material for a desktop computer motherboard. Background technique [0002] A computer, commonly known as a computer, is an electronic computing machine used for high-speed calculations. It can perform numerical calculations, logic calculations, and storage and memory functions. It is a modern intelligent electronic device that can run according to programs and process massive amounts of data automatically and at high speed. , consists of a hardware system and a software system, and a computer without any software installed is called a bare metal. [0003] The motherboard is the "stone" of the computer. A motherboard is mainly composed of a circuit board and various components on it. The circuit board is generally an epoxy resin printed circuit board, and its base material is mainly an epoxy resin copper-clad laminate. "The circuit, a...
Claims
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