Horizontal electroplating production line for circuit boards

Abstract

The invention discloses a horizontal electroplating production line for circuit boards and relates to the technical field of electroplating for the circuit boards. The horizontal electroplating production line for the circuit boards comprises a cleaning device, an electroplating device and a dehumidifying device and further comprises a transfer device, wherein the cleaning device, the electroplating device and the dehumidifying device are horizontally distributed in the transverse direction; the transfer device can convey the circuit boards to the cleaning device, the electroplating device and the dehumidifying device and penetrates through the cleaning device, the electroplating device and the dehumidifying device; the circuit boards to be electroplated are horizontally placed on the transfer device; and liquid chemical in the electroplating device is in a perpendicular flowing state all the time. By means of the horizontal electroplating production line for the circuit boards, the mobility of the liquid chemical in interconnecting holes of the circuit boards can be improved, and thus electroplating meets the technical requirements for the high-quality and high-reliability interconnecting holes.

Description

technical field [0001] The invention relates to the technical field of circuit board electroplating, in particular to a circuit board horizontal electroplating production line. Background technique [0002] The electroplating of traditional circuit boards adopts the vertical electroplating method regardless of the gantry line or VCP. In the traditional circuit board production line, the circuit board is vertically clamped by a fixture and immersed in the potion during the electroplating process, and the circuit board is shaken by a mechanism with a shaking function to make the potion flow in the interconnection holes of the circuit board , Forming electroplating under the action of conductive liquid. [0003] There are at least the following problems in the prior art: 1. The conventional vertical electroplating process cannot meet the technical requirements of high-quality, high-reliability interconnection holes, especially interconnection holes with an aperture aspect rati...

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Problems solved by technology

[0003] There are at least the following problems in the prior art: 1. The conventional vertical electroplating process cannot meet the technical requirements of high-quality, high-reliability interconnection holes, especially interconnection holes with an aperture aspect ratio of 5:1; 2. Restricted by electroplating The depth of the tank cannot be used for electroplating of large-sized products; 3. Open operation is used, which pollutes the environment relatively; 4. Water washing basically adopts two-stage washing, which consumes a lot of water and produces more wastewater; 5. Use fixtures to operate , the pinch point will be plated with copper along with the product, and subsequent copper elimination treatment will be required to increase the cost

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