Robot integration platform used for chip packaging
An integrated platform and chip packaging technology, which is applied in the direction of conveyor objects, transportation and packaging, semiconductor/solid device manufacturing, etc., can solve the problems of unfavorable chip packaging quality and efficiency, and achieve high handling efficiency, low cost, and resin loading high efficiency effect
Pending Publication Date: 2017-12-08
ANHUI HISEED ROBOT CO LTD
View PDF12 Cites 9 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
[0002] Integrated circuit packaging requires high precision and a dust-free environment. Semi-automatic equipment is still used in the field of chip packaging today, which requires manpower for loading and unloading. Manual operation of plastic sealing presses, punching machines, and chip arranging machines is not conducive to improving the quality of chip packaging. and efficiency
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment 1
[0036] Embodiment 1: as figure 1 — Figure 19 As shown, Embodiment 1 includes the device of the present invention, an automatic sheet unloading machine 8 , an automatic plastic sealing press 9 and an automatic mold washing machine 10 . The device of the present invention includes a fully automatic resin alignment machine 6, a first handling robot 5, a second handling robot 4, an automatic stamping machine 7, a material rack transfer warehouse 3, a finished material box 2, an integrated platform frame 1 and an electrical cabinet 11; Platform frame 1 comprises main frame frame 102 and frame top plate 101, and frame top plate 101 is made up of several regular plates, and frame top plate 101 is fixed on the main frame frame 102, and automatic resin feeder 6 is placed on the ground, and Located inside the main frame frame 102, the first transport robot 5, the second transport robot 4, the automatic punching machine 7, the material rack transfer warehouse 3 and the finished materia...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a robot integration platform used for chip packaging, and belongs to the technical field of automatic packaging equipment for chips. The robot integration platform includes a first carrying robot, a second carrying robot, an automatic punching machine, a material rack transfer warehouse and a resin array machine; the resin array machine includes a vibrating disk, a plane rectangular coordinate robot, a transition conveying mechanism, a feed mechanism, a material rack mechanism and a climbing mechanism, the material input end of the transition conveying mechanism is located at the material output end of the vibrating disk, the material input end of the feed mechanism is located at the material output end of the transition conveying mechanism, the feed mechanism is mounted on the plane rectangular coordinate robot, and the climbing mechanism acts on the material rack mechanism; and the first carrying robot is matched with the material rack mechanism and the material rack transfer warehouse through a quick-change connector for use, and the second carrying robot is used for carrying materials between the automatic punching machine and the material rack transfer warehouse. The device provided by the invention can complete full-automatic transformation of traditional semi-automatic chip packaging equipment, and the transformation cost is low.
Description
technical field [0001] The invention belongs to the technical field of automatic chip packaging equipment, and in particular relates to a robot integration platform for chip packaging. Background technique [0002] Integrated circuit packaging requires high precision and a dust-free environment. Semi-automatic equipment is still used in the field of chip packaging today, which requires manpower for loading and unloading. Manual operation of plastic sealing presses, punching machines, and chip arranging machines is not conducive to improving the quality of chip packaging. and efficiency. The price of fully automatic chip packaging equipment is high, and the price of a single piece of equipment is as high as millions. At the same time, the abandonment of semi-automatic packaging equipment will cause waste of resources and environmental pollution. It has very important social value for the economic transformation of current semi-automatic packaging equipment. and economic valu...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/677H01L21/56
CPCH01L21/56H01L21/67739
Inventor 张良安刘俊王彪冯卓崔越孙洒
Owner ANHUI HISEED ROBOT CO LTD