Rare earth tin-based alloy for copper alloy hot-plating and preparation method thereof

A tin-based alloy, rare earth technology, applied in hot dip plating process, metal material coating process, coating and other directions, can solve the problems of long residence time at room temperature, short circuit of electronic connectors or integrated circuit boards, etc., to achieve wettability Good, improved spreading ability, effect of solid solution strengthening alloy hardness

Inactive Publication Date: 2019-06-21
HENAN UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Pure tin should not be directly used in the hot-dip plating process. The main reason is that the long residence time at room temperature or high temperature work will easily cause conductive whiskers to form on the surface of the hot-dip tin material, causing short circuits in electronic connectors or integrated circuit boards. It is of great significance to study tin-based alloys for hot-dip copper alloy materials

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0019] A rare-earth tin-based alloy for Cu-Ni series alloy strip hot-plating, consisting of the following elements in mass fraction: 0.2% Cu, 0.05% Y, 0.005% P, the balance being Sn and unavoidable impurity elements ;

[0020] The preparation method of the rare earth tin-based alloy comprises the following steps:

[0021] (1) Preparation of master alloy: prepare master alloy SnCu7, master alloy SnY10 and master alloy CuP1.5 respectively by the following method: weigh the ingredients according to the mass fraction of each element of the master alloy (taking SnCu7 as an example, according to the mass ratio of 93: 7 Weigh Sn and Cu), put it into a water-cooled copper-jacketed vacuum non-consumable melting furnace, evacuate to a pressure of 0.007Pa in the furnace, and then fill it with argon to 0.2-0.3MPa, arc melting until the ingredients are completely melted, and close the arc Cool the melt until it is completely solidified, turn over the solidified melt, repeat the steps of m...

Embodiment 2

[0025] A rare-earth tin-based alloy for Cu-Ni series copper alloy strip hot-plating, composed of the following elements by mass fraction: 0.6% Cu, 0.125% Y, 0.0075% P, the balance being Sn and unavoidable impurities element;

[0026] The preparation method is the same as in Example 1; the performance indicators of the prepared rare earth tin-based alloy are: standard electrode potential 0.3381V, melting point 188.6°C, tensile strength 75.5MPa, and elongation 30.7%.

Embodiment 3

[0028] A rare-earth tin-based alloy for Cu-Ni series alloy strip hot-plating, composed of the following elements by mass fraction: 1.0% Cu, 0.2% Y, 0.01% P, the balance being Sn and unavoidable impurity elements ;

[0029] The preparation method is the same as in Example 1; the performance indicators of the prepared rare earth tin-based alloy are: standard electrode potential 0.3346V, melting point 193.1°C, tensile strength 89.4MPa, and elongation 21.3%.

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Abstract

The invention relates to rare earth tin-based alloy for hot-dip coating of copper alloy. The rare earth tin-based alloy comprises the following elements by mass percent: 0.1-1.0% of Cu, 0.01-0.25% of Y, 0.003-0.05% of P and the balance of Sn and inevitable impurity elements. The rare earth tin-based alloy has the following performance indexes: standard electrode potential 0.3343-0.3442 V, melting point 182.9-193.1 DEG C, tensile strength 59.1-90.7 MPa and ductility 21.3-47.4%. As coating alloy, the rare earth tin-based alloy has the advantages that a clad layer is small in IMC thickness and minor in thickness increase trend, and has low probabilities of hollows and whiskers during use.

Description

technical field [0001] The invention relates to the field of metal coating materials, in particular to a rare earth tin-based alloy for copper alloy hot-plating and a preparation method thereof. Background technique [0002] Tinned copper alloy strips are widely used in high-end fields such as aerospace, military industry, automobiles, communications and electronics. Although my country's copper strip industry continues to develop, tinned copper alloy strips still cannot meet market demand. At present, the research on the structure, performance and production process of the tin-plated layer of copper alloy strips mainly focuses on the research of electro-tin plating. The main advantage of electro-tin plating is that the thickness of the coating metal can be controlled at will, but its production process is cumbersome and the operation requirements are strict. , The price of electroplating equipment is high, and the composition of electroplating solution is complicated. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C13/00C22C1/03C23C2/08
CPCC22C1/03C22C13/00C23C2/08
Inventor 田保红张毅殷婷刘玉亮王冰洁孙国强田然张晓辉赵转刘勇贾淑果宋克兴
Owner HENAN UNIV OF SCI & TECH
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