Electrodeposition Auxiliary Measuring Method for Gap in Micro Electrolytic Wire Cutting

Abstract

The invention relates to a wire electrochemical micro-machining gap electro-deposition auxiliary measuring method and belongs to the technical field of precise and micro electrochemical processing. The wire electrochemical micro-machining gap electro-deposition auxiliary measuring method is characterized by comprising the following processes that two different electrochemical deposition methods are utilized, namely, metal ions are deposited from the end of a wire electrochemical micro-machining micro seam structure or the surface of a used microscale line electrode till processing gaps are filled completely, and the position of the microscale line electrode relative to the end surface of the micro seam structure is completely fixed. From the direction of the workpiece thickness, the processing gaps are subjected to layered polish-grinding, actual measuring and data correction, and the distribution model of the processing gaps is established through mathematical modeling and image reconstruction. The wire electrochemical micro-machining gap electro-deposition auxiliary measuring method has the important significance on the wire electrochemical micro-machining theoretical research.

Description

technical field [0001] The invention relates to a micro-electrolytic wire cutting processing gap electrodeposition auxiliary measurement method, which belongs to the technical field of precision and micro-electrochemical processing. Background technique [0002] Micro-electrolytic wire-cutting processing technology uses micro-scale metal wires as tool electrodes, combined with ultra-short pulse current technology, and realizes the processing of micro-slits, groove structures, and micro-parts with complex shapes and high aspect ratios through the feed motion of the wire electrode. Due to its good surface quality, no cracks and burrs, no heat-affected zone, no loss of tool electrodes, and a wide range of processing materials, it has broad application prospects in aerospace, micro-sensors, micro-robots, biomedical engineering and other fields. [0003] In the micro-electrolytic wire cutting process, the processing process is actually the forming electrolytic processing process ...

AI Technical Summary

Problems solved by technology

In the actual processing process, the processing gap is not only affected by the electric field, but also affected by the comprehensive effects of multiple fields such as the flow field and the temperature field, which makes the distribution of the processing gap more complicated.

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