Wafer laser marking technology implementation method and system based on CAD (computer aided design)

Abstract

The invention discloses a wafer laser marking technology implementation method and system based on CAD (computer aided design), and the method comprises the steps: drawing a die distribution diagram, making clear the shot and die of a marked wafer and discriminating the complete die and a part of die; selecting shot, which needs to serve as a light plate angle, from the die distribution diagram, setting a laser mark size, judging whether the light plate angle accommodates a laser mark or not, and calculating the number of lost effective dies and the angle of the laser mark; carrying out the marking through the calculated angle of the laser mark if the degree that the current light plate angle accommodates the laser mark and the number of the lost effective dies are both acceptable, or else switching to step 2 and carrying out the redesigning. According to the invention, the method can help a customer find the proper light plate angle, can determines the parameters of a corresponding laser mark formula of the light plate angle, and can achieve the development of the virtual laser marking technology which can be iterated quickly.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a computer-aided design-based wafer laser marking process realization method and system. Background technique [0002] At present, in the chip manufacturing process, a laser will be used to print a mark on the wafer before shipment (that is, the laser mark process), and the packaging and testing factory will use this mark as the unique identification of the wafer. However, the laser mark can only be placed on the front side of the wafer, which will cause the loss of effective die. At the same time, too dense chip arrangement will affect the recognition of the laser mark by the packaging and testing factory. [0003] For flash memory products, a certain shot at the edge of the wafer is generally used as the light panel angle, and no exposure is performed from the back end, and the packaging and testing factory will align it according to the light panel angle. ...

AI Technical Summary

Problems solved by technology

[0005] However, whether the angle of the light board selected by the customer can accommodate the laser mark as much as possible, whether the loss of effective die can be minimized, and how to set the laser mark program after the light board angle is determined, it is difficult to evaluate in advance, accurately and quickly only by manual work , usually need to use wafer (wafer) test, which increases the difficulty for the development of laser mark (laser mark) process

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