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Sensor and method for producing same

A sensor and filter technology, applied in the field of sensor and sensor manufacturing, can solve problems such as difficult manufacturing and damage to electronic parts

Active Publication Date: 2018-01-02
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the signal terminal is disconnected, stress is applied to the soldered electronic parts, and the electronic parts may be damaged.
In addition, it is necessary to perform a process of disconnecting the signal terminals in the middle of the soldering process, and there is a problem that it is difficult to manufacture

Method used

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  • Sensor and method for producing same
  • Sensor and method for producing same
  • Sensor and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

no. 1 Embodiment approach

[0042] based on Figure 1 to Figure 13The first embodiment of the present disclosure will be described.

[0043] The sensors 20 and 120 of the first embodiment of the present disclosure are used in figure 1 In the throttle device shown. The throttle device 10 is an electronically controlled valve device that adjusts the intake air amount of the engine (not shown).

[0044] First, refer to Figure 1 ~ Figure 3 The throttle device 10 will be described.

[0045] The throttle device 10 includes a main body 11 , a valve body 12 , a rotary shaft 13 , a motor 14 , a bracket 15 , magnets 16 and 17 , a cover 18 , sensors 20 and 120 , and wirings 22 to 27 . The through hole 28 of the main body 11 constitutes a part of the intake passage of the engine. The valve body 12 rotates together with the rotary shaft 13 to change the opening degree of the through hole 28 , that is, the throttle opening degree. The motor 14 rotates and drives the rotary shaft 13 . The bracket 15 is cylindr...

no. 2 Embodiment approach

[0122] Figure 14 The second embodiment of the present disclosure is shown in .

[0123] Such as Figure 14 As shown, in the sensor 220 of the present embodiment, the shapes of the first signal terminal 67 and the second signal terminal 68 are different from those of the sensor 20 of the first embodiment.

[0124] The first signal terminal 67 has a base 671 and a protrusion 672 . The base portion 671 is formed in substantially the same shape as the base portion 371 of the signal terminal 37 of the first embodiment, and is connected to the signal lead 33 at the base end side, and the exposed portion 373 is exposed from the front end portion 505 of the sealing body 50 at the front end side.

[0125] The protrusion 672 protrudes toward the ground terminal 36 side. In this embodiment, the protrusion 672 includes a first protrusion 673 extending toward the ground terminal 36 side and a second protrusion 674 extending from the first protrusion 673 toward the front end. A connect...

no. 3 Embodiment approach

[0133] exist Figure 15 The third embodiment of the present disclosure is shown in .

[0134] Such as Figure 15 As shown, the ground terminal 76 of the sensor 320 of this embodiment has a base 761 and a protrusion 762 . The base portion 761 is formed in substantially the same shape as the ground terminal 36 of the first embodiment, and is connected to the signal lead 33 on the base end side, and the exposed portion 363 is exposed from the front end portion 505 of the sealing body 50 on the front end side. The protrusion 762 protrudes from the base portion 761 toward the first signal terminal 77 side.

[0135] The first signal terminal 77 has a base 771 and a protrusion 772 . The base portion 771 is formed in substantially the same shape as the base portion 371 of the first embodiment, and is connected to the signal lead 33 on the base end side, and the exposed portion 373 is exposed from the front end portion 505 of the sealing body 50 on the front end side. The protrusio...

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Abstract

A sensor is provided with: an integrated circuit (30, 130, 430) having a power source lead (31, 431), a ground lead (32, 432), and a signal lead (33, 433); a power source terminal (35, 85, 95) connected to the power source lead; a ground terminal (36, 76, 96) connected to the ground lead; a first signal terminal (37, 67, 77, 87, 97) connected to the signal lead; a second signal terminal (38, 68, 98) connected to the first signal terminal; a filter member (41-43, 45) of which one end is connected to one of the terminals and the other end is connected to one of the other terminals; and a sealingbody (50, 550) for sealing the integrated circuit, the terminals, and the filter member. A part of each of the terminals is exposed from the sealing body.

Description

[0001] Cross-references to related applications [0002] This application is based on Japanese Patent Application No. 2015-123793 filed on June 19, 2015 and Japanese Patent Application No. 2016-95266 filed on May 11, 2016, the entire contents of which are incorporated herein. technical field [0003] The present disclosure relates to a sensor and a method of manufacturing the sensor in which part of electronic components and terminals including an integrated circuit are molded (molded) with a sealing body. Background technique [0004] Conventionally, the following sensors are known, equipped with: an integrated circuit that outputs an electrical signal corresponding to a physical quantity related to a detection object; a plurality of terminals connected to the leads of the integrated circuit; capacitors provided between the terminals, and the integrated circuit and the capacitor Molded enclosure. The sensor disclosed in Patent Document 1 uses a Hall IC as an integrated cir...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01P1/02H10N52/80H10N52/00H10N52/01
CPCG01D5/24428H01L23/3107G01P1/02G01D5/145H03H7/06H10N59/00G01D5/245H10B61/00H10N52/80H10N52/01H10N52/101H01L25/16
Inventor 伊藤武志久保田贵光河野祯之
Owner DENSO CORP