Small square silicon core high-precision cutting process
A cutting process, high-precision technology, applied in the direction of fine working devices, manufacturing tools, stone processing equipment, etc., can solve the problems of diamond wire deviation, affecting product quality and yield, and inconvenient adjustment of verticality, so as to prevent Deviation, effect of guaranteeing product quality and yield
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[0023] The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments.
[0024] A high-precision cutting process for small square silicon cores in this embodiment includes the following process steps:
[0025] Step 1, see figure 1 , take a cylindrical silicon rod, the silicon rod includes upper and lower sections, the upper section is a polysilicon section, the lower section is a monocrystalline silicon section, and four ridges are evenly arranged on the peripheral wall of the monocrystalline silicon section along its length direction;
[0026] Step two, see figure 1 , four guiding resin strips are glued on the end face of the monocrystalline silicon section of the silicon rod with glue, and the guiding resin strips are vertically arranged with the end surface of the monocrystalline silicon section. Corresponding to the positions of the four ridges on the peripheral wall of the monocrystalline silicon segment;
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