Unlock instant, AI-driven research and patent intelligence for your innovation.

High-current monitoring method for integrated circuit test system

A test system and integrated circuit technology, applied in overload protection devices and other directions, can solve problems such as burning test probes, transient high current, etc., to avoid damage and improve stability.

Inactive Publication Date: 2018-01-05
BEIJING CHIPADVANCED
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual production test process, it may still happen that the current of a specific pin appears a transient large current before it is clamped, thus burning the test probe

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-current monitoring method for integrated circuit test system
  • High-current monitoring method for integrated circuit test system
  • High-current monitoring method for integrated circuit test system

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0024] The present invention will be described in further detail below in conjunction with the accompanying drawings.

[0025] The implementation process of the present invention is as figure 1 shown, including the following steps:

[0026] (1) Build a high-current test environment;

[0027] For the case where the test items that may have a large current have been identified and there are few monitoring test items, it can be as follows figure 2 As shown, the method of separately monitoring specific test items is adopted, and the large current monitoring function is enabled for a single test item. When the transient current of a pin exceeds the set clamping current, the system will send out an alarm, and the chip will be treated as a bad product to prevent further damage to the test system.

[0028] When there are many test items that need to be monitored and the monitoring target is not clear, using the method of individually monitoring the test items will make the program...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention provides a high-current monitoring idea and a method for an integrated circuit test system, which are implemented by using different architectures for two different requirementsof a single test item and an entire test process. A verification scheme of a monitoring mechanism is introduced. By adjusting three indicators of the monitoring shielding time, the clamping current and the voltage conversion rate related to current monitoring, stable and accurate high-current monitoring is achieved. In the debugging stage, the method can partially replace the expensive current meter to debug the test item with high current, can effectively protect the test probe from being burned due to the long-term current oversize in the mass production stage, and can greatly improve the test stability.

Description

technical field [0001] The invention relates to a current monitoring method of a testing system, which belongs to the technical field of integrated circuit testing. Background technique [0002] With the development of semiconductor technology, wafer testing plays an increasingly significant role in device performance analysis and product reliability assurance. During the wafer test process, due to hardware design and chip defects, the current of the test pin may exceed the expected value. The long-term current exceeding the expected value may cause the test probe to burn out and even affect the test machine. . [0003] The usual test procedure will adopt the method of setting the clamping current to clamp the maximum current of the test channel at a fixed value so that it will not rise again, so as to ensure the safety of the test probe and the test machine. However, in the actual production test process, it may still happen that a specific pin current has a transient lar...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01R1/36
Inventor 刘伟金兰
Owner BEIJING CHIPADVANCED