Power Module Package Structure

Abstract

A power module packaging structure, the power module includes: a substrate with a first conductive region, a second conductive region, a third conductive region, a first fixed connection region and a second fixed connection region, the first conductive region, the first conductive region The two conductive regions and the third conductive region are electrically connected to the first terminal, the second terminal and the third terminal, and the first switch group and the second switch group are electrically connected by the first fixed connection region and the second fixed connection region , so as to achieve mutual parallel arrangement between each other. The first terminal is a current input terminal, the second terminal is a relay terminal, and the third terminal is a current output terminal. When the current flows from the current input terminal to the relay terminal, or from the relay terminal to the current output terminal, the current takes a straight line path to reduce the crossover area of ​​the power module current loop and reduce the loop leakage inductance.

Description

technical field [0001] The invention relates to a package structure of a power module, in particular to a package structure of a power module with low loop leakage inductance. Background technique [0002] In today's industrial automation or electric vehicle field, the demand for inverters with high withstand voltage and high load is increasing day by day, so the design of the power module also faces many challenges, one of which is the terminal connecting the power module with the external circuit. The shape and arrangement of the terminals will affect the leakage inductance of the power module. If the design is not proper, the leakage inductance will be too high, and the product with low withstand voltage will be easily damaged. In addition, terminals are usually soldered to the substrate by solder. Due to the difference in thermal expansion coefficient between the terminal and the substrate, the solder at the joint between the terminal and the substrate is prone to cracks...

AI Technical Summary

Problems solved by technology

Depend on Figure 2A , 2B It can be seen that the structure of the power module 100B is mainly improved for these terminals (31B, 32B, 33B), but there is no ink on the reduction of the crossover area of ​​the current loop of the power module 100B.

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