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Chemical plating device with guide wheel

An electroless plating device and guide wheel technology, applied in the field of electroless plating equipment, can solve the problems that chemical reagents cannot be recycled and reused, and the time of electroless plating cannot be changed, so as to achieve the effect of changing the soaking time and simple operation

Inactive Publication Date: 2018-01-09
邰宝龙
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Electroless immersion plating is referred to as electroless plating. The principle of its technology is: electroless plating is a method that does not require electricity. According to the principle of oxidation-reduction reaction, a strong reducing agent is used in a solution containing metal ions to reduce metal ions to metal and deposit them on various surfaces. A method for forming a dense coating on the surface of a material. In the production of soft material lines, the time of chemical plating cannot be changed due to different material needs, and the redundant chemical reagents in the material after chemical plating cannot be recycled and reused.

Method used

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  • Chemical plating device with guide wheel
  • Chemical plating device with guide wheel
  • Chemical plating device with guide wheel

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Embodiment Construction

[0015] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention.

[0016] refer to Figure 1-3 , an electroless plating device with guide wheels, comprising a base 1, a reaction tank 2 is arranged on the base 1, chemical reagents are placed in the reaction tank 2, and the liquid level of the reagent is located above the guide wheels 23, the side of the reaction tank 2 The wall is provided with a winding mechanism 3, and the winding mechanism 3 is similar to a uniform roller, which is a prior art, and will not be described here. Two first guide mechanisms 4 are arranged in the reaction tank 2, and the reaction tank 2 is far away from the winding One end side wall of mechanism 3 is provided with second guiding mechanism 5, and first g...

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Abstract

The invention discloses a chemical plating device with a guide wheel. The device comprises a base, the base is provided with a reaction groove, the side wall of the reaction groove is provided with acoiling mechanism, two first guide mechanisms are arranged in the reaction groove, the side wall of the end, away from the coiling mechanism, of the reaction groove is provided with a second guide mechanism, the base is provided with two first supporting rods which are arranged at the end, close to the second guide mechanism, of the base, a collection groove is arranged between the two first supporting rods, the front end and the rear end of the collection groove are connected with the side walls of the two first supporting rods correspondingly, the lower end of the collection groove is connected with a drainage pipe, the end, away from the collection groove, of the drainage pipe is connected with the side wall of the reaction groove, a lower extrusion roller is arranged between the two first supporting rods, and the lower extrusion roller is located above the collection groove. The material chemical plating time can be controlled, excessive chemical reagent on the chemically-plated materials can be recycled, and operation is easy.

Description

technical field [0001] The invention relates to the technical field of electroless plating equipment, in particular to an electroless plating device with guide wheels. Background technique [0002] Electroless immersion plating is referred to as electroless plating. The principle of its technology is: electroless plating is a method that does not require electricity. According to the principle of oxidation-reduction reaction, a strong reducing agent is used in a solution containing metal ions to reduce metal ions to metal and deposit them on various surfaces. The method for forming a dense coating on the surface of a material cannot change the time of electroless plating due to different material needs during the production of soft material lines, and cannot recycle and reuse the redundant chemical reagents in the material after electroless plating. Contents of the invention [0003] The object of the present invention is to propose an electroless plating device with guide...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C18/16
Inventor 邰宝龙
Owner 邰宝龙
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