Method for improving hole sealing of blue gel ink of PCB board

Abstract

The invention relates to a method for improving hole sealing of blue gel ink of a PCB board. The method comprises the following steps of making a punching belt by reference to a position which needs screen printing of the blue gel ink on the surface of the PCB board; selecting a fiberboard and carrying out plate opening process by reference to the size of the PCB board; adopting the punching beltand punching an empty slot into the fiberboard; bonding the punched fiberboard and a mesh through an adhesive tape and glue and drying; mounting a screen on a screen printing table; blocking a throughhole whose aperture is greater than 3.0 mm at the back of the PCB board through a high temperature resistant adhesive tape; selecting an NPTH hole on the PCB board as a positioning hole and fixing onthe screen printing table through a locating pin; carrying out screen printing on the blue gel ink on the PCB board; drying the PCB board; and tearing the adhesive tape to complete. The blue gel inkin the through hole with the large aperture and the blue gel ink on the surface of the PCB board are integrated, when the blue gel ink is torn off, the rupture of the blue gel ink cannot occur and thehole has no residual blue glue ink, so that the production efficiency is greatly improved and the good quality guarantee is also provided for SMT.

Description

technical field [0001] The invention relates to the field of PCB processing, in particular to a method for improving the hole sealing of PCB blue glue ink. Background technique [0002] For PCB boards with blue glue ink, the customer requires that the large holes (dia>3.0mm) in the board also need to be sealed with blue glue ink. According to the normal practice, the blue glue ink cannot be sealed, and the customer The finished board was broken when the blue glue ink was removed, and the blue glue ink remained in the hole, which affected the SMT. It was necessary to manually remove the blue glue ink in the hole before going to SMT, which was very labor-intensive and material resources. Contents of the invention [0003] In order to achieve the above object, the present invention adopts the following technical scheme: a method for improving the sealing of PCB blue glue ink, is characterized in that, comprises the steps: [0004] S1: Make the gong belt, refer to the ...

AI Technical Summary

Problems solved by technology

[0002] For PCB boards with blue glue ink, the customer requires that the large holes (dia>3.0mm) in the board also need to be sealed with blue glue ink. According to the normal practice, the blue glue ink cannot be sealed, and the customer The finished board was broken when the blue glue ink was removed, and the blue glue ink remained in the hole, which affected the SMT. It was necessary to manually remove the blue glue ink in the hole before going to SMT, which was very labor-intensive.