A semiconductor device including interconnected superposed packaging bodies
A semiconductor and packaging technology, applied in semiconductor devices, semiconductor/solid-state device components, electrical solid-state devices, etc., can solve the problems of long bonding wires easily damaged, short circuit, low signal-to-noise ratio, etc.
Inactive Publication Date: 2018-01-12
SANDISK INFORMATION TECH SHANGHAI
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- Description
- Claims
- Application Information
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Problems solved by technology
However, this can result in long bond wires from the upper die down to the substrate
Long bond wires are easily damaged or shorted to other wire bonds and also have a lower signal-to-noise ratio than short wire bonds
Additionally, the large number of semiconductor dies in a package can adversely affect yield
Method used
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[0027] The present technology will now be described with reference to the accompanying drawings, which in an embodiment relate to a semiconductor device including vertically stacked and interconnected semiconductor packages. It should be understood that the invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the invention to those skilled in the art. Indeed, the invention is intended to cover alternatives, modifications and equivalents of these embodiments, which are included within the scope and spirit of the invention as defined by the appended claims. Furthermore, in the following detailed description of the invention, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art that the pr...
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A semiconductor device is disclosed. The semiconductor device at least includes a first semiconductor packaging body and a second semiconductor packaging body which are vertically stacked. Signal communication between the second semiconductor packaging body and a host machine device is realized through the first semiconductor packaging body. The disclosure raises the product yield rate.
Description
technical field [0001] The present disclosure relates to semiconductor devices. Background technique [0002] The strong growth in demand for portable consumer electronics is driving the demand for high-capacity storage devices. Nonvolatile semiconductor memory devices, such as flash memory memory cards, are being widely used to meet the increasing demand for digital information storage and exchange. Its portability, versatility and rugged design, as well as its high reliability and large capacity, have made such memory devices ideal for use in a wide variety of electronic devices, including, for example, digital cameras, digital music players, video Game controllers, PDAs and mobile phones. [0003] Although a number of different packaging configurations are known, flash memory memory cards can typically be manufactured as a system-in-package (SiP) or multi-chip module (MCM), in which case multiple die are mounted and interconnected into a small footprint (footprint) on ...
Claims
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IPC IPC(8): H01L25/11H01L23/485
CPCH01L25/105H01L25/50H01L2225/06575H01L2225/1023H01L2225/1041H01L2225/1058H01L2225/06562H01L2225/06572H01L2224/05554H01L2224/49175H01L2924/00014H01L24/48H01L2224/32145H01L2224/48145H01L2224/48228H01L2224/48463H01L25/0657H01L2224/49105H01L2225/06506H01L2225/0651H01L2924/1438H01L2924/181H01L2924/37001H01L23/5385H01L23/5384H01L23/49816H01L23/5386H01L2224/73265H01L2224/2919H01L2224/45099H01L2924/00012H01L2924/0665H01L2924/00H01L23/28H01L23/58H01L24/30H01L24/46H01L24/97H01L25/074H01L25/117H01L25/0756H01L25/04H01L25/112H01L25/043H01L24/17H01L24/49H01L2225/06517
Inventor 邱进添H.塔吉娅
Owner SANDISK INFORMATION TECH SHANGHAI