Novel through hole structure

Abstract

The invention particularly relates to a novel through hole structure which is composed of a signal area and a ground area, wherein the signal area is isolated from the ground area through an isolationarea; hollowed areas are formed in two sides of the isolation area; the signal area and the ground area are positioned on the outer side of the hollowed areas; anti-pads are arranged on the outer sides of the signal area and the ground area; the signal area can be connected with a single signal line or a differential signal line; and the signal part and the ground part of a through hole are positioned on two sides of the through hole, respectively, so that a wiring manner of forming an extra grounding hole is avoided. The novel through hole structure can provide shielding for signal lines, sothat crosstalk and radiation can be greatly reduced. Meanwhile, the parasitic inductance of the signal through hole can be increased, the stray capacitance of the through hole is decreased, the discontinuity of transmission-line impedance at the through hole is greatly decreased by controlling the increase of through-hole impedance, and the signal integrity is further improved.

Description

technical field [0001] The invention relates to the technical field of memory system design, in particular to a novel via hole structure. Background technique [0002] With the development of cloud computing and big data, the demand for servers and storage is increasing. In the design of servers and storage, in order to meet the different needs of customers, the functions of servers are becoming more and more powerful, followed by high-speed signal There are more and more lines, and the signal rate is getting higher and higher. [0003] How to design high-quality high-speed signal lines in a limited space is becoming more and more important, and vias are one of the keys that affect the design quality of high-speed lines. Reasonable design of vias can reduce the impedance at the vias. Continuous, reducing crosstalk, thereby improving signal integrity design quality. [0004] Traditional via structure as attached figure 1 As shown, it includes anti-pad, pad, copper plated a...

AI Technical Summary

Problems solved by technology

[0007] When traditional vias are used to connect a single signal line, there are generally no ground holes near the signal hole (the space is limited), so the quality of a single signal will be affected

For differential signal lines, two ground vias are generally drilled on both sides of the differential via, which will occupy a large amount of board area.

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