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A coating process for fpc flexible circuit board

A flexible circuit board and process technology, which is applied in the secondary processing of printed circuits, metal material coating process, sputtering coating, etc. Effect

Active Publication Date: 2019-12-31
MINGGAO CIRCUIT BOARDS GANZHOU
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The surface coating of existing flexible circuit boards adopts the traditional form of double-sided gluing. The purpose of protecting the substrate is achieved by forming an adhesive film on both sides of the flexible circuit board substrate. However, in actual use, the traditional double-sided The film structure is difficult to meet the actual working conditions, so the overall damage rate is very high

Method used

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Examples

Experimental program
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Effect test

Embodiment Construction

[0019] The technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0020] In Embodiment 1 of the present invention, a FPC flexible circuit board coating process mainly includes the following steps:

[0021] S1. Preliminary cleaning of the FPC substrate, using negative ion airflow to blow soot on the FPC substrate for 3 minutes at a flow rate of 1.2m / s;

[0022] S2. Perform secondary soot blowing on the initially cleaned FPC substrate, using a clean inert gas source to blow soot on the FPC substrate at a flow rate of 1.5m / s for 1min;

[0023...

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PUM

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Abstract

The invention discloses a FPC (flexible printed circuit board) film coating process. The film coating process mainly comprises the steps of performing primary cleaning, performing secondary ash blowing, performing film coating at the bottom of a base material, performing optical curing treatment on the coated film at the bottom of the base material, and performing gelatinizing on the surface partof the base material, and the like. The film coating mode adopted by the method is simple and quick; by adoption of different processing processes on the two surfaces and by virtue of vacuum evaporation film coating and thermal pressing film coating, film coating layers of different effects are formed on the two surfaces of the FPC base material; and compared with the single film coating process,the overall performance of the film coating process disclosed in the invention is improved while the corresponding cost is lower.

Description

technical field [0001] The invention relates to the field of flexible circuit board processing, in particular to a FPC flexible circuit board coating process. Background technique [0002] Flexible circuit board is a kind of highly reliable and excellent flexible printed circuit board made of polyimide or polyester film as the base material. It has the characteristics of high wiring density, light weight, thin thickness and good bendability. [0003] The surface coating of existing flexible circuit boards adopts the traditional form of double-sided gluing. The purpose of protecting the substrate is achieved by forming an adhesive film on both sides of the flexible circuit board substrate. However, in actual use, the traditional double-sided The film structure is difficult to meet the actual working conditions, so the overall damage rate is very high. Contents of the invention [0004] In order to overcome the disadvantages of the above-mentioned situation, the present in...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/24C23C14/24B05D3/02
Inventor 熊建明吉兴荣
Owner MINGGAO CIRCUIT BOARDS GANZHOU