Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Method for establishing transistor noise model capable of scaling along with offset

A noise model and establishment method technology, applied in special data processing applications, instruments, electrical digital data processing, etc., can solve time-consuming, cumbersome and complex problems, achieve simplified extraction process, simplified modeling process, and intuitive parameter results Effect

Inactive Publication Date: 2018-01-19
CHENGDU HIWAFER SEMICON CO LTD
View PDF2 Cites 10 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to solve the cumbersome and time-consuming technical problems in the establishment method of the transistor noise model in the prior art, the present invention further provides a transistor noise model establishment method that scales with the bias

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Method for establishing transistor noise model capable of scaling along with offset
  • Method for establishing transistor noise model capable of scaling along with offset
  • Method for establishing transistor noise model capable of scaling along with offset

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0019] In order to solve the complicated and time-consuming technical problems in the method for establishing a transistor noise model in the prior art, the present invention further provides a method for establishing a transistor noise model that scales with bias.

[0020] In order to solve the above technical problems, the above technical solutions will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0021] The present invention provides a method for establishing a transistor noise model scaled with bias, such as figure 1 shown, including: S101, measuring the DC IV characteristics of the transistor, selecting a DC IV model, and using the DC IV model to fit the tested DC IV data to obtain an accurate DC IV model; S102, based on the accurate DC IV model model, calculate the small-signal model parameters of the transistor, and obtain the small-signal model of the transistor; S103, based on the accurate DC IV model, obtain the...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention relates to the technical field of semiconductor integrated circuit manufacture, and discloses a method for establishing a transistor noise model capable of scaling along with offset. Themethod comprises the following steps that: measuring the direct current IV features of a transistor, selecting a direct current IV model, and using the direct current IV model to fit tested direct-current IV data to obtain an accurate direct-current IV model; on the basis of the accurate direct-current IV model, calculating the small signal model parameter of the transistor to obtain the small signal model of the transistor; on the basis of the accurate direct current IV model, obtaining the noise current sources of the drain electrode and the grid electrode of the transistor, and correlationthereof; and importing the drain electrode noise current source and the grid electrode noise current source of the transistor and the correlation thereof into the small signal model of the transistor, and calculating four noise parameters of the transistor. Therefore, a modeling process is greatly simplified, modeling time is greatly shortened, the method is simple and efficient, is high in accuracy and is easy in expansion.

Description

technical field [0001] The invention relates to the technical field of semiconductor integrated circuit manufacturing, and in particular, to a method for establishing a transistor noise model that scales with bias. Background technique [0002] In the design of integrated circuits, it is not only necessary to use the device model to simulate the circuit topology to verify whether the designed circuit structure meets the index requirements, but also to put forward relevant performance requirements for the device process according to the design index of the circuit; , which not only controls the repeatability of the process according to the parameter values ​​of the relevant components in the device equivalent circuit model, but also optimizes the device design process according to the extracted device equivalent circuit parameters to further improve the performance of the integrated circuit. Nowadays, with the increase of chip design index requirements and circuit operating f...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): G06F17/50
Inventor 陈勇波
Owner CHENGDU HIWAFER SEMICON CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products