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adhesive sheet

A technology of adhesive sheets and adhesives, applied in the direction of adhesives, film/sheet adhesives, pressure-sensitive films/sheets, etc., can solve the problem of not being able to fully eliminate chip pairing, and achieve the effect of preventing reattachment

Active Publication Date: 2021-09-07
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, with the further miniaturization of ceramic capacitors, even with the method of using stretchable adhesive sheets, it has gradually become impossible to sufficiently eliminate chip pairing

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0100] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples. Evaluation methods in Examples are as follows. In addition, in the following evaluation, the adhesive sheet from which the separator was peeled was used. In addition, in an Example, unless otherwise indicated, "part" and "%" are based on weight.

[0101] (1) Adhesion

[0102] Cut the adhesive sheet into width: 20mm, length: 140mm, according to JIS Z 0237:2009, make a 2kg roller reciprocate once, stick the adhesive surface on the SUS304BA board of the adherend, let it stand for 30 minutes and then irradiate Ultraviolet rays (irradiation dose 600mJ / cm 2 ). This measurement sample was set in a tensile testing machine (manufactured by Shimadzu Corporation, trade name "Shimadzu Autograph AG-120kN") with a constant temperature bath. Then, measure the load when the adherend is peeled from the adhesive sheet in the longitudinal direction under the condi...

manufacture example 1

[0129] [Production Example 1] Production of Extensible Base Material 1

[0130] Using a T-die molding machine (manufactured by Placo Co., Ltd., set temperature: 230°C), an olefin-based thermoplastic elastomer (propylene-ethylene copolymer, propylene component 86 mol% / ethylene component 14 mol%, Mitsubishi Chemical Corporation Co., Ltd., brand name "Zelas 7053"), the stretchable base material 1 (thickness: 40 micrometers) was produced. In addition, corona treatment was given to one surface of the stretchable base material 1 .

manufacture example 2

[0131] [Manufacture Example 2] Manufacture of an extensible base material 2

[0132] Using a T-die molding machine (manufactured by Placo Co., Ltd., set temperature: 230°C), an olefin-based thermoplastic elastomer (propylene-ethylene copolymer, propylene component 72.5 mol% / ethylene component 17.5 mol%, Mitsubishi Chemical Corporation Co., Ltd., brand name "Zelas 5053"), the stretchable base material 2 (thickness: 45 micrometers) was produced. In addition, corona treatment was given to one surface of the stretchable base material 2 .

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Abstract

The present invention provides a PSA sheet which can be used for fixing electronic component materials (for example, green sheets), and which can prevent reattachment of cut chips when the electronic component material is cut on the PSA sheet. The pressure-sensitive adhesive sheet of the present invention has an extensible substrate, and an adhesive layer disposed on one side or both sides of the extensible substrate, and the adhesive layer contains an adhesive and thermally expandable microspheres, so that The relationship between the thickness of the adhesive layer and the modulus of elasticity based on the nano-indentation method when the adhesive sheet is closely bonded to the adherend is: 0.05 (MPa·μm ‑1 )≤(1 / thickness of adhesive layer (μm))×elastic modulus based on nanoindentation method (MPa)≤40(MPa·μm ‑1 ), the adhesion of the adhesive sheet to SUS304BA is preferably more than 0.1N / 20mm.

Description

technical field [0001] The present invention relates to an adhesive sheet. Background technique [0002] In recent years, miniaturization and precision of electronic components have been demanded, and miniaturization is also advancing in ceramic capacitors. [0003] As an example of the manufacturing method of the above-mentioned ceramic capacitor, the method through the following steps can be mentioned: (1) a printing process of printing electrodes on a ceramic pre-sintered sheet (hereinafter also referred to as a green sheet); (3) Pressurizing the laminated body obtained in (2); (4) Cutting the pressed laminated body into a predetermined size (for example, 0.4mm×0.2mm) and separate to obtain chips cutting process; and (5) sintering process of sintering the obtained chips. Usually, in a printing process - a cutting process, a to-be-processed object is fixed on the adhesive sheet, and it processes. [0004] Heretofore, it has been known that the chips obtained after the c...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J7/38C09J7/20H01L21/683
Inventor 平山高正副岛和树福原淳仁西尾昭德有满幸生
Owner NITTO DENKO CORP