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Substrate processing apparatus and method

A substrate processing device and technology for substrates are applied in chemical instruments and methods, cleaning methods and utensils, cleaning methods using liquids, etc. Intrusion effect

Active Publication Date: 2006-01-04
DAINIPPON SCREEN MTG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in order to process the holding portion where the substrate is held by the chuck pins, sometimes the chuck pins of the substrate are opened and closed (unhold the substrate) during the processing, but at this time, the processing liquid that moves outward in the radial direction of the substrate due to the chuck pins is particularly easy to spring back

Method used

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  • Substrate processing apparatus and method
  • Substrate processing apparatus and method
  • Substrate processing apparatus and method

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Embodiment Construction

[0029] figure 1 It is a figure which shows the 1st Embodiment of the substrate processing apparatus of this invention. In this substrate processing apparatus, a chemical solution such as a chemical or an organic solvent and a rinse solution such as pure water or DIW (hereinafter referred to as "processing liquid") are supplied to the surface of a substrate W such as a semiconductor wafer, and the chemical solution is applied to the substrate W. A device that spins and dries after processing and rinsing. In this substrate processing apparatus, the processing liquid can be supplied to the lower surface of the substrate W to process the lower surface, and since the processing liquid is supplied to the lower surface of the substrate W, the processing liquid can be made to flow along the substrate from the lower surface of the substrate W. The peripheral end surface of W extends to the upper surface (device formation surface), and the peripheral portion of the upper surface of th...

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Abstract

In the vicinity of a rim portion of a spin base 5 , a plurality of supports 7 which abut on a bottom rim portion of a substrate W and support the substrate W are formed projecting toward above from the spin base 5 . The substrate W is supported horizontally by the plurality of supports 7 , with a predetermined distance ensured from the spin base 5 which opposes the bottom surface of the substrate W. Into the space which is created between the top surface of the substrate W and an opposing surface 9 a of an atmosphere blocker plate 9 , inert gas is ejected from a plurality of gas ejection outlets 9 b which are formed in the opposing surface 9 a. The inert gas thus supplied to the top surface of the substrate W presses the substrate W against the supports 7 and the substrate W is held at the spin base 5.

Description

technical field [0001] The present invention relates to the process of supplying a treatment liquid to various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, and substrates for optical disks, and performing cleaning and other treatments on the substrates. Substrate processing apparatus and substrate processing method. Background technique [0002] Conventionally, as such a substrate processing apparatus, there is a substrate processing apparatus in which a substrate such as a semiconductor wafer is supported on a disk-shaped rotary base member rotatably supported around a vertical axis, and the substrate is rotated while rotating the substrate. A processing liquid such as a chemical liquid is supplied to the upper and lower surfaces of the substrate to process the substrate (see Patent Document 1). In the substrate processing apparatus described in Patent Document ...

Claims

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Application Information

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IPC IPC(8): B08B3/08H01L21/302
Inventor 宫胜彦安藤幸嗣
Owner DAINIPPON SCREEN MTG CO LTD
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