Substrate processing apparatus and method

Abstract

In the vicinity of a rim portion of a spin base 5 , a plurality of supports 7 which abut on a bottom rim portion of a substrate W and support the substrate W are formed projecting toward above from the spin base 5 . The substrate W is supported horizontally by the plurality of supports 7 , with a predetermined distance ensured from the spin base 5 which opposes the bottom surface of the substrate W. Into the space which is created between the top surface of the substrate W and an opposing surface 9 a of an atmosphere blocker plate 9 , inert gas is ejected from a plurality of gas ejection outlets 9 b which are formed in the opposing surface 9 a. The inert gas thus supplied to the top surface of the substrate W presses the substrate W against the supports 7 and the substrate W is held at the spin base 5.

Description

technical field

[0001] The present invention relates to the process of supplying a treatment liquid to various substrates such as semiconductor wafers, glass substrates for photomasks, glass substrates for liquid crystal displays, glass substrates for plasma displays, and substrates for optical disks, and performing cleaning and other treatments on the substrates. Substrate processing apparatus and substrate processing method. Background technique

[0002] Conventionally, as such a substrate processing apparatus, there is a substrate processing apparatus in which a substrate such as a semiconductor wafer is supported on a disk-shaped rotary base member rotatably supported around a vertical axis, and the substrate is rotated while rotating the substrate. A processing liquid such as a chemical liquid is supplied to the upper and lower surfaces of the substrate to process the substrate (see Patent Document 1). In the substrate processing apparatus described in Patent Document ...

Images