Anti-metal label and manufacturing methods thereof
A technology for anti-metal labels and manufacturing methods, which is applied in the direction of record carriers used by machines, antenna supports/mounting devices, instruments, etc., which can solve the problem that the appearance of anti-metal labels cannot maintain integrity, it is difficult to realize automated mass production, and the label surface Unable to meet the requirements and other problems, to achieve the effect of improving anti-demolition performance, low production cost, and smooth appearance
Inactive Publication Date: 2018-01-26
SHANGHAI FUDAN MICROELECTRONICS GROUP
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Problems solved by technology
This solution does have tamper-resistant performance, but this method cannot maintain the integrity of the appearance of the anti-metal label, and the connection cost of the sub-substrate is high, and it is not easy to realize automated mass production. If a sub-substrate with good reliability is required, the packaging cost will be higher. High, and the surface of the label cannot meet the requirements of some specific occasions because of the rectangular transparent groove
Method used
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Embodiment Construction
[0036] based on the following Figure 1 ~ Figure 3 , specifically explain the preferred embodiment of the present invention.
[0037] Such as figure 1 and figure 2 As shown, the present invention provides an anti-metal tag, comprising: an antenna body 1 and a plastic package 2 mounted on the upper surface of the antenna body 1 .
[0038] The antenna body 1 includes: a substrate 101, an antenna radiation surface 102 arranged on the upper surface of the substrate 101, an antenna ground surface 103 arranged on the lower surface of the substrate 101, and a groove 104 arranged on the upper surface of the substrate 101; In this embodiment, the base material 101 is made of ceramic or PCB, the antenna radiating surface 102 is made of metal, and the antenna grounding surface 103 is made of metal.
[0039] Such as figure 1 and figure 2 As shown, in one embodiment, several via holes 105 penetrating the antenna radiation surface 102 and the antenna ground plane 103 may be provided ...
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The invention discloses an anti-metal label and manufacturing methods thereof. The anti-metal label comprises an antenna body and a plastic encapsulated body in selective attachment installation connection on an upper surface of the antenna body. The antenna body comprises a base material, an antenna radiation face arranged on an upper surface of the base material, an antenna grounding face arranged on a lower surface of the base material, and a groove arranged in the upper surface of the base material. The plastic encapsulated body is arranged on the groove, and includes a lead wire frame, aplurality of pins connected with the lead wire frame and a label chip connected with the pins. A positive pole of the label chip is connected with one of the pins through a lead wire. A negative poleof the label chip is connected with another one of the pins through a lead wire. The pins connected with the label chip in the plastic encapsulated body are connected with the antenna radiation face through a surface attachment installation manner. The pins not connected with the label chip in the plastic encapsulated body are not connected. The label improves anti-dismantlement performance, has good reliability, can be suitable for use in a harsh environment, is flat and neat in appearance after installation, can satisfy a lettering or printing need, is suitable for large-scale mass production, and is low in production costs.
Description
technical field [0001] The invention relates to an anti-metal label and a manufacturing method thereof. Background technique [0002] For anti-metal labels, the chip is generally pasted on the substrate with epoxy resin adhesive, and then the positive and negative poles of the UHF chip are connected to the radiation surface of the antenna by welding wires, and finally the chip is encapsulated with black glue. The reliability of this structure is poor, and the long-term harsh environment is prone to PCB and welding wire breakage, resulting in functional failure, and it is easy to remove the complete label, and the processing capacity is low and the cost is high. [0003] In order to improve anti-tampering performance, Chinese patent application No. 201110152675.4 discloses a UHF anti-metal electronic tag structure with anti-tampering function, and proposes to connect a chip with a transparent rectangular main substrate through a sub-substrate. way to achieve anti-tampering p...
Claims
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IPC IPC(8): G06K19/077H01Q1/22
Inventor 黄玉财孟祥旺陈德华王磊孟祥晨娄浩涣
Owner SHANGHAI FUDAN MICROELECTRONICS GROUP