Cooling film and preparation method thereof
A heat-dissipating film, graphene film technology, applied in semiconductor/solid-state device manufacturing, telephone structure, electrical components, etc., can solve problems such as unreasonable heat dissipation, excessive software, reduced comfort, etc., to achieve fast and effective transmission and divergence , the effect of fast conduction
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[0035] In order to make the content of the present invention clearer and easier to understand, the content of the present invention will be further described below in conjunction with the accompanying drawings. Of course, the present invention is not limited to this specific embodiment, and general replacements known to those skilled in the art are also covered within the protection scope of the present invention.
[0036] A heat dissipation film of the present invention comprises: a graphene film, a first nano-metal layer at the bottom of the graphene film, and a second nano-metal layer at the bottom of the first nano-metal layer. Moreover, the ratio of air gaps in the first nanometer metal layer is greater than the ratio of air gaps in the second nanometer metal layer.
[0037] The following is attached Figure 1-9 The present invention will be described in further detail with specific examples. It should be noted that the drawings are all in a very simplified form, using ...
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