Flexible circuit board connection alignment method and alignment structure

Abstract

The invention provides a flexible printed circuit board connection aligning method. The flexible printed circuit board connection aligning method includes the following steps: respectively setting atleast one group of positioning holes in at least two flexible printed circuit boards to be connected, wherein each group of positioning holes has two holes; and realizing aligning between the flexibleprinted circuit boards by inserting probes in the positioning holes. The invention also provides a flexible printed circuit board connection aligning structure. The flexible printed circuit board connection aligning structure includes at least one group of positioning holes in the at least two flexible printed circuit boards to be connected and probes for enabling the flexible printed circuit boards to align and each group of positioning holes has two holes. Compared with the prior art, the positioning holes are formed in the connection area of the flexible printed circuit boards to be connected for FOF (FPC (Flexible Print Circuit) on FPC Bonding) connection, and aligning of the flexible printed circuit boards can be realized by inserting the probes in the positioning holes, so that thealigning precision can be improved and the product yield rate after FOF connection can also be improved. As the aligning precision is improved, the center distance of the metal contacts can be reduced, and signal lines are added, so that the demand for ever-increasing miniaturization can be satisfied.

Description

technical field [0001] The invention relates to a liquid crystal display panel technology, in particular to a flexible circuit board connection alignment method and alignment structure. Background technique [0002] Now the connection technology between circuit boards has become more and more mature. Among them, the connection of larger components in the display device adopts soldering, snap-fit ​​connection, and ACF (Anisotropic Conductive Film, anisotropic conductive film) connection. ACF connection and soldering can be called FOF Bonding (FPC on FPC Bonding, that is, the connection between the flexible circuit board and the flexible circuit board), but these two common connection methods have the following problems: [0003] 1. The alignment accuracy of the two FPCs (Flexible Print Circuit, flexible circuit board) is low when connected, because the FPCs of the two devices are connected to the same object, and their relative positions have been fixed. Some equipment will ...

AI Technical Summary

Problems solved by technology

[0003] 1. The alignment accuracy of the two FPCs (Flexible Print Circuit, flexible circuit board) is low when connected, because the FPCs of the two devices are connected to the same object, and their relative positions have been fixed

Some equipment will use suction nozzles to fix the upper and lower FPCs to make them align. However, in the actual process, the FPC suspended on the top will warp due to the weight. After the machine grabs it, there will be errors in the position of the mark or Fuzzy, even if the alignment of the previous FPC is good, the alignment of the next FPC will be wrong, making it difficult to carry out mass production

[0004] 2. The other is that most of the equipment is a manual machine, which requires manual alignment, and it is difficult to semi-automate and automate the machine

[0005] Due to these problems, the center distance of the metal contacts used for FOF Bonding on each FPC is designed to be very wide (400-500μm), which results in a small number of metal contacts and fewer signal lines

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