Rough leadframe with a nanolayer of silver
A lead frame and nano-layer technology, applied in electrical components, electrical solid devices, circuits, etc., can solve the problems of increasing surface wettability of lead frames.
Active Publication Date: 2018-01-30
STMICROELECTRONICS SDN BHD
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- Application Information
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Problems solved by technology
[0004] Unfortunately, however, the roughened surface of the leadframe also increases the wettability of the surface
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[0015] It will be understood that, while specific embodiments of the disclosure have been described herein for purposes of illustration, various modifications may be made without departing from the spirit and scope of the disclosure.
[0016] In the following description, certain specific details are set forth in order to provide a thorough understanding of various aspects of the disclosed subject matter. However, the disclosed subject matter may be practiced without these specific details. In some instances, well-known structures and semiconductor processing methods (eg, semiconductor power devices) including embodiments of the subject matter disclosed herein have not been described in detail so as not to obscure the description of other aspects of the present disclosure.
[0017] Figure 1A is a top-down view of a semiconductor package without encapsulation material according to one embodiment. Figure 1B yes Figure 1A The semiconductor package in the Figure 1A A close-up...
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Abstract
A rough leadframe with a nanolayer of silver is disclosed. One or more embodiments are directed to leadframes and leadframe semiconductor packages. One embodiment is directed to copper leadframes withone or more die pads and one more leads with a roughened surface. Covering the roughened surface of the die pad of the leadframe is nanolayer of Silver (Ag). The thickness of the nanolayer preferablyhas a thickness that corresponds to the roughened surface of the copper leadframe. For instance, in one embodiment, the copper leadframe is roughened to have peaks and valleys that approximately average 10 nanometers and the thickness of the nanolayer is 10 nanometers. Covering a portion of the nanolayer of Ag is a microlayer of Ag, which provides a suitable bonding surface for coupling a semiconductor die to the die pad by an adhesive material.
Description
technical field [0001] Embodiments of the present disclosure relate to lead frame packages and methods of manufacturing the same. Background technique [0002] Leadframe packages are widely used in the semiconductor industry and, in general, provide a low cost solution with relatively straightforward assembly handling. However, various barriers remain to maintaining proper adhesion between certain materials within a leadframe package. [0003] To improve leadframe adhesion, one or more surfaces of the leadframe may be roughened. In that regard, materials such as adhesives and encapsulants may adhere better to the surface of the lead frame during assembly handling. [0004] Unfortunately, however, the roughened surface of the lead frame also increases the wettability of the surface. Accordingly, adhesive material used to couple the semiconductor die or chip to the roughened surface of the leadframe may flow or bleed over the roughened surface of the leadframe due to capill...
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IPC IPC(8): H01L23/495H01L21/60
CPCH01L2924/181H01L2924/143H01L2924/141H01L23/3121H01L23/49503H01L23/49575H01L24/32H01L2224/04042H01L2224/32245H01L2224/48091H01L2224/48247H01L2224/48464H01L2224/73265H01L2224/83192H01L2224/83385H01L2224/83439H01L2224/85385H01L2224/85439H01L2224/92247H01L24/29H01L24/48H01L24/49H01L24/83H01L24/85H01L24/92H01L2224/05554H01L2224/291H01L2224/29116H01L2224/49173H01L2224/49175H01L2224/83815H01L2924/15747H01L2924/3512H01L2924/00014H01L23/49513H01L23/49548H01L23/49582H01L2924/00012H01L2924/0105H01L2924/01047H01L2924/014H01L2224/45099
Inventor 王远丰
Owner STMICROELECTRONICS SDN BHD