Wafer packaging structure of surface acoustic wave filter and manufacturing process thereof
A surface acoustic filter, wafer packaging technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive/magnetostrictive devices, electrical components, etc., can solve the surface acoustic wave filtering It can solve the problems of damage to the device, high cost of the surface sealing cover, and strict requirements on the flatness of the substrate and sealing cover, so as to achieve the effect of low cost, small size and low packaging reliability.
Pending Publication Date: 2018-02-02
XIAMEN SKY SEMICON TECH CO LTD
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Problems solved by technology
[0003] 1. The cost of the surface sealing cover is relatively high;
[0004] 2. The reliability of the product has strict requirements on the flatness of the substrate and the sealing cover, which is easy to cause failure
Method used
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Embodiment Construction
[0036] The present invention will be further described below in conjunction with specific drawings and embodiments.
[0037] The manufacturing process of the wafer packaging structure of the surface acoustic filter comprises the following steps:
[0038] Step S1, such as figure 1 As shown, a wafer is provided as a substrate 1, an insulating layer 2 is first deposited on the front of the substrate 1, and then a piezoelectric material 3 is deposited on the insulating layer 2 on the front of the substrate 1; then input and output ports 4 are fabricated on the piezoelectric material 3;
[0039] In this step, the material of the wafer can be silicon or diamond; the material of the insulating layer 2 is silicon dioxide; the input and output ports 4 are made by electroplating, sputtering, or printing, and the material is metal;
[0040] Step S2, such as figure 2 As shown, the input and output ports 4 are covered with viscose 5 on the front of the substrate 1, and the thickness of ...
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The invention provides a wafer packaging structure of a surface acoustic wave filter. The wafer packaging structure comprises a matrix. The front surface of the matrix is provided with an insulating layer. A piezoelectric material is deposited on the insulating layer on the front surface of the matrix. Input / output ports are manufactured on the piezoelectric material. The input / output ports are packaged by adhesive which is arranged on the front surface of the matrix. A cover board is bonded to the front surface of the matrix. The cover board presses the adhesive. A chamber is formed between the cover board and the piezoelectric material on the front surface of the matrix. The back surface of the matrix is provided with a slope and blind holes which are communicated with the input / output ports. An insulating layer and a seed layer are deposited on the sidewall of the blind hole, the slope and the back surface of the matrix. A metal line is electroplated on the seed layer. The metal line is connected with the input / output ports on the front surface of the matrix, and extends to the back surface of the matrix through the slope. A back surface passivation layer on the back surface ofthe matrix is provided with openings. Packaging electric connecting units which are connected with the metal line are manufactured on the openings. The wafer packaging structure has advantages of reducing cost and reducing technical difficulty in manufacturing.
Description
technical field [0001] The invention relates to a packaging structure of a surface acoustic wave device, in particular to a packaging structure system of a surface acoustic wave filter. Background technique [0002] At present, the main packaging technology of surface acoustic wave filter is still in the form of wire-bonded ceramic, metal, and plastic packaging. The existing packaging structure of this type of surface acoustic wave filter has the following disadvantages: [0003] 1. The cost of the surface sealing cover is relatively high; [0004] 2. The reliability of the product has strict requirements on the flatness of the substrate and the sealing cover, which is likely to cause failure. [0005] 3. A series of uncertainties such as the accuracy of device installation, the influence of signal wires, and the angle of welding will cause inconsistency in device performance, and even cause damage to the surface acoustic wave filter. Contents of the invention [0006] T...
Claims
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IPC IPC(8): H01L41/053H01L41/23H10N30/88H10N30/02
CPCH10N30/88H10N30/02
Inventor 姜峰
Owner XIAMEN SKY SEMICON TECH CO LTD