A kind of process method of modified HBN filled cyanate resin-based composite material

A technology of filling cyanate ester and cyanate resin, which is applied in the field of thermally conductive materials, can solve problems such as low thermal conductivity and poor thermal conductivity, and achieve the effects of improving service life, improving thermal conductivity, and increasing bonding strength

Active Publication Date: 2019-11-29
北京联合涂层技术有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As a resin matrix, cyanate resin usually has low thermal conductivity (about 0.18W / m·k), and poor thermal conductivity

Method used

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  • A kind of process method of modified HBN filled cyanate resin-based composite material
  • A kind of process method of modified HBN filled cyanate resin-based composite material

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0023] Example 1: Preparation of unmodified flake hBN filled cyanate resin-based composite material with a weight fraction of 20%

[0024] In this example, 20 g of hBN without surface treatment was filled into an 80 g container of cyanate resin added with E-7 epoxy resin, and stirred for 30 min with a special stirring device at a speed of 100 rpm / min. Inject the uniformly mixed material into the mold coated with silicone oil release agent through the injection device. The cylindrical mold size is φ25.4x35mm. Place the mold with the material in a vacuum oven, vacuumize at 90-100°C for 20 minutes, solidify at 120°C / 1h+150°C / 1h+180°C / 2h+200°C / 4h, and cool naturally to room temperature. The detection needs to be cut to the required size.

[0025] Corresponding to the production of composite materials, the density and thermal conductivity are tested, and the density measured by the corresponding test is 0.92g / cm 3 ; The thermal conductivity is 0.72W / (m·K).

Embodiment 2

[0026] Example 2: Preparation of 20wt.% modified (1.5% coupling agent) flake hBN filled cyanate resin-based composite material

[0027] In this example, 20g flake hBN treated with 1.5wt% WD-60 type coupling agent was added to an 80g container of cyanate resin added with E-7 epoxy resin, and stirred with a special stirring device for 30min. Speed ​​100rpm / min. Inject the uniformly mixed material into the mold coated with silicone oil release agent through the injection device. The cylindrical mold size is φ25.4x35mm, and the square mold size is 10x10x5mm. Place the mold with the material in a vacuum oven, vacuumize at 90-100°C for 20 minutes, and after 120°C / 1h+150°C / 1h+180°C / 2h+200°C / 2h, put the resin composite mold Place it in a constant temperature device at 200°C, and apply a pressure of 1kgf to the resin composite material with a special pressurizing device to make the composite material denser. Put the pressurized mold back in a vacuum oven at 200°C, keep it warm for 1 ...

Embodiment 3

[0029] Example 3: Preparation of 20wt.% modified (3.5% coupling agent) flake hBN filled cyanate resin-based composite material

[0030] In this example, 20g flake hBN treated with 3.5% Z-6020 type coupling agent was added to 80g container of cyanate resin added with E-7 epoxy resin, stirred by magnetic stirring device for 10min, rotating speed 150rpm / min. The uniformly mixed material is injected into a mold coated with silicone oil release agent through an injection molding device. The cylindrical mold size is φ25.4x35mm, and the square mold size is 10x10x8mm. Place the mold with the material in a vacuum oven, vacuumize at 90-100°C for 20 minutes, press 120°C / 1h+150°C / 1h+180°C / 2h+200°C / 1h; after that, put the resin composite material The mold is placed in a constant temperature device at 200°C, and a pressure of 1 kgf is applied to the resin composite material with a special pressure device to make the composite material denser. Put the pressurized mold back in a vacuum ove...

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Abstract

The invention discloses a mthod for modifying hBN-filled cyanate ester resin based thermal conductive composite, and belongs to the field of thermal conductive polymer materials. The composite contains 10%-50% by weight of hBN and 50%-90% by weight of cyanate ester resin. A technological method for the composite comprises the steps as follows: firstly, performing surface modification on ultrasonically dispersed hBN particles by using a coupling agent to improve wettability between the hBN particles and a cyanate ester resin matrix; filling the cyanate ester resin matrix toughened by 1.5wt%-3wt% of E-7 epoxy resin with modified hBN, and obtaining the modified hBN-filled cyanate ester resin based thermal conductive composite through mixing, injection molding, vacuum curing and other processes. The hBN / cyanate ester resin composite with high thermal conductivity obtained with the method has good development prospect not only in the field of electronic components such as printed circuit boards, but also in the field of heat dissipation materials with high thermal conductivity and high insulation performance requirements.

Description

technical field [0001] The invention belongs to the research field of heat-conducting materials, and provides a method for modifying hBN and filling cyanate resin-based composite materials. Background technique [0002] Cyanate resin has excellent electrical insulation properties (low dielectric constant), mechanical properties, excellent resistance to heat and humidity, and good molding process. Therefore, as a resin-based matrix with excellent comprehensive performance, cyanate resin has been used in high-speed digital and high-frequency printed circuit boards, high-performance copper-clad laminates, high-performance wave-transparent materials (such as radome) and aviation composite resin matrix . As a resin matrix, cyanate resin usually has low thermal conductivity (about 0.18W / m·k), and its thermal conductivity is poor. With the development of integration technology and micro-encapsulation technology, electronic components, electronic equipment and logic circuits are d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L79/04C08L63/00C08K9/04C08K7/00C08K3/38C09K5/14
CPCC08L79/04C08L2203/20C09K5/14C08L63/00C08K9/04C08K7/00C08K2003/385
Inventor 张有茶贾成厂贾鹏贾永昌
Owner 北京联合涂层技术有限公司
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