Ceramic package shell

Abstract

The invention provides a ceramic package shell, and belongs to the technical field of ceramic package. The ceramic package shell comprises a ceramic shell, a plurality of leads and a sealing ring, wherein the ceramic shell is formed by laminating multiple layers of ceramic sheets, the plurality of leads are connected with the ceramic shell, the sealing ring is arranged at a mouth part of an accommodating cavity of the ceramic shell, the plurality of leads are vertically led out of a surface of the ceramic shell, a rectangular structure is encircled by the leads on a surface of the ceramic shell, four edges of the rectangular structure are in one-to-one correspondence to four edges of the ceramic shell, and one end, far away from the ceramic shell, of the lead at each edge is integrally connected by a connection piece. In the ceramic package shell provided by the invention, the leads are vertically led out of the surface of the ceramic shell, and the leading-out positions can be arranged according to requirement of a client; and moreover, the leads are not led out of a side surface, the arrangement mode of the leads on the surface of the ceramic shell is flexible and versatile, thevolume of a device also can be reduced, the miniaturization of the device is achieved, and the installation volume is reduced.

Description

technical field [0001] The invention belongs to the technical field of ceramic packaging, and more specifically relates to a ceramic packaging shell with a single T-shaped lead wire at the bottom. Background technique [0002] The traditional DIP package shell (DIP is the abbreviation of dual inline-pin package, also called dual-in-line packaging technology) leads out from both sides of the long side, and the common lead-out pitch is 2.54mm, such as Figures 7 to 9 As shown, the DIP-packaged CPU chip has two rows of pins and needs to be inserted into a chip socket with a DIP structure. Because the ratio between the chip area and the packaging area is large, the volume is also large. Most small and medium-scale integrated circuits use this packaging form, and the number of pins generally does not exceed 100. When the number of leads is large (greater than 16 lines), the traditional CDIP (ceramic dual-in-line package-ceramic dual-in-line package) shell is used to lead the lead...

AI Technical Summary

Problems solved by technology

[0003] The purpose of the present invention is to provide a ceramic packaging shell, which can solve the technical problems of large package shell size and inflexible lead arrangement in the prior art

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