Back-illuminated imaging sensor packaging structure and preparing method thereof

An image sensor and packaging structure technology, which is applied to electric solid state devices, semiconductor devices, radiation control devices, etc., can solve the problems of cumbersome and complicated process steps and high cost, and achieve the effects of shortening process time, saving costs, and saving process steps.

Pending Publication Date: 2018-02-27
SJ SEMICON JIANGYIN CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In view of the above-mentioned shortcomings of the prior art, the purpose of the present invention is to provide a back-illuminated image sensor packaging structure and its preparation method, which are used to solve t

Method used

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  • Back-illuminated imaging sensor packaging structure and preparing method thereof
  • Back-illuminated imaging sensor packaging structure and preparing method thereof
  • Back-illuminated imaging sensor packaging structure and preparing method thereof

Examples

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Example Embodiment

[0063] Example 1

[0064] see figure 1 The present embodiment provides a method for preparing a package structure of a backside illuminated image sensor. The method for preparing a package structure for a backside illuminated image sensor includes the following steps:

[0065] 1) provide a support substrate;

[0066] 2) forming a back-illuminated image sensor on the surface of the supporting substrate;

[0067] 3) using a laser to form a laser through hole in the support substrate, the laser through hole penetrates the support substrate up and down, and exposes part of the back-illuminated image sensor;

[0068]4) forming a dielectric layer on the sidewall of the laser through hole and the surface of the supporting substrate away from the back-illuminated image sensor;

[0069] 5) forming a conductive plug in the laser through hole, the conductive plug fills the laser through hole and is electrically connected to the back-illuminated image sensor;

[0070] 6) forming a red...

Example Embodiment

[0106] Embodiment 2

[0107] please continue Figure 14, this embodiment also provides a back-illuminated image sensor packaging structure, the back-illuminated image sensor packaging structure can be prepared by but not limited to the preparation method of the back-illuminated image sensor packaging structure described in the first embodiment. , the package structure of the back-illuminated image sensor includes: a supporting substrate 10; a back-illuminated image sensor 11, the back-illuminated image sensor 11 is located on the supporting substrate 10; a laser through hole 12, the laser The hole 12 is located in the supporting substrate 10 and penetrates the supporting substrate 10 up and down to expose part of the back-illuminated image sensor 11 ; the dielectric layer 13 is located in the laser through hole 12 sidewalls of the supporting substrate 10 and the surface of the supporting substrate 10 away from the backside illuminated image sensor 11 ; conductive plugs 14 loc...

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Abstract

The invention provides a back-illuminated image sensor packaging structure and a preparation method thereof. The back-illuminated image sensor packaging structure includes: a supporting substrate; a back-illuminated image sensor located on the supporting substrate; a laser through hole located on the supporting substrate Inside, and through the support substrate up and down; dielectric layer, located on the side wall of the laser through hole and the surface of the support substrate away from the back-illuminated image sensor; conductive plug, located in the laser through hole, and electrically connected to the back-illuminated image sensor ; The rewiring layer is located on the surface of the dielectric layer and is electrically connected to the conductive plug; the solder bump is located on the surface of the rewiring layer away from the dielectric layer and is electrically connected to the rewiring layer. The present invention forms a laser through hole in the supporting substrate as the lead-out through hole for electrically leading out the back-illuminated image sensor, does not involve a through-silicon hole process, can effectively save process steps, greatly shorten process time, and save photoresist and mask use, greatly saving costs.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, in particular to a back-illuminated image sensor packaging structure and a preparation method thereof. Background technique [0002] With the development of technology, back-illuminated image sensors (BSI CIS) are widely used in various fields. In the existing process, when the back-illuminated image sensor is packaged, the through-silicon via (TSV) process is generally used to form a connection via hole in the supporting substrate supporting the back-illuminated image sensor, and the connection via hole is filled with metal. forming a conductive plug; and then forming a rewiring layer and a solder bump on the surface of the support substrate away from the back-illuminated image sensor to realize the electrical extraction of the back-illuminated image sensor. However, the existing through-silicon via process design processes such as exposure, etching, and electroplating have prob...

Claims

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Application Information

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IPC IPC(8): H01L27/146
CPCH01L27/14636H01L27/14638H01L27/14643H01L27/14683H01L27/14689
Inventor 陈彦亨林正忠吴政达
Owner SJ SEMICON JIANGYIN CORP
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