Back-illuminated imaging sensor packaging structure and preparing method thereof
An image sensor and packaging structure technology, which is applied to electric solid state devices, semiconductor devices, radiation control devices, etc., can solve the problems of cumbersome and complicated process steps and high cost, and achieve the effects of shortening process time, saving costs, and saving process steps.
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[0063] Example 1
[0064] see figure 1 The present embodiment provides a method for preparing a package structure of a backside illuminated image sensor. The method for preparing a package structure for a backside illuminated image sensor includes the following steps:
[0065] 1) provide a support substrate;
[0066] 2) forming a back-illuminated image sensor on the surface of the supporting substrate;
[0067] 3) using a laser to form a laser through hole in the support substrate, the laser through hole penetrates the support substrate up and down, and exposes part of the back-illuminated image sensor;
[0068]4) forming a dielectric layer on the sidewall of the laser through hole and the surface of the supporting substrate away from the back-illuminated image sensor;
[0069] 5) forming a conductive plug in the laser through hole, the conductive plug fills the laser through hole and is electrically connected to the back-illuminated image sensor;
[0070] 6) forming a red...
Example Embodiment
[0106] Embodiment 2
[0107] please continue Figure 14, this embodiment also provides a back-illuminated image sensor packaging structure, the back-illuminated image sensor packaging structure can be prepared by but not limited to the preparation method of the back-illuminated image sensor packaging structure described in the first embodiment. , the package structure of the back-illuminated image sensor includes: a supporting substrate 10; a back-illuminated image sensor 11, the back-illuminated image sensor 11 is located on the supporting substrate 10; a laser through hole 12, the laser The hole 12 is located in the supporting substrate 10 and penetrates the supporting substrate 10 up and down to expose part of the back-illuminated image sensor 11 ; the dielectric layer 13 is located in the laser through hole 12 sidewalls of the supporting substrate 10 and the surface of the supporting substrate 10 away from the backside illuminated image sensor 11 ; conductive plugs 14 loc...
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