Water-based organic paste and aluminum solder paste comprising paste

A paste-forming, water-based technology, applied in the treatment of dyed low-molecular organic compounds, dyed high-molecular organic compounds, welding media, etc., can solve the problems of residual carbon deposition, smoke generation, environmental protection, etc., and achieve improved anti-settling performance , The effect of increasing the viscosity of the system and improving the fineness

Active Publication Date: 2018-03-06
广州有研焊接材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The main reasons are: (1) Due to the low viscosity of water, the aluminum flux can not be effectively bonded together; (2) The oily organic matter may not be well mixed with inorganic matter (powdered) due to its own properties or formulation conditions. Aluminum flux and solder) are organically fused, resulting in the separation of solid and liquid phases in the feeding tube when the aluminum solder paste made of them is pneumatically propelled and fed, forming a blockage, and continuous automatic feeding cannot be realized
[0005] In addition, if water is used as the carrier, due to the chemical activity of powdered aluminum solder, it will chemically react with water, resulting in thickening of the oxide scale of aluminum solder and affecting the welding quality.
If oily organic matter is used as the carrier, due to its greasy, it will lead to environmental sanitation and not easy to clean; it will produce smoke when heating and welding, which is not environmentally friendly; cracking is difficult to complete, and carbon deposits will remain after welding, etc.

Method used

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  • Water-based organic paste and aluminum solder paste comprising paste
  • Water-based organic paste and aluminum solder paste comprising paste
  • Water-based organic paste and aluminum solder paste comprising paste

Examples

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Embodiment 1

[0042] An embodiment of the water-based organic paste of the present invention, the water-based organic paste of the present embodiment comprises the following components in mass percentage:

[0043] Water-based organic solvent and water-based polymer (ethylene glycol: copovidone = 89:11) 94%, surfactant (octylphenol polyoxyethylene ether) 5%, chemical passivator (triethanolamine borate) 1%.

[0044] In this embodiment, an aluminum solder paste comprising the aqueous organic paste, the mass percentage of the aqueous organic paste in the aluminum solder paste is 30%, and the aluminum flux, aluminum solder The total mass percentage in the aluminum solder paste is 70%, the weight ratio of the aluminum brazing flux to the aluminum brazing filler metal is: aluminum brazing flux: aluminum brazing filler metal = 1:1, and the aluminum brazing flux is fluorine Potassium aluminate, the melting temperature of the aluminum solder is 550-570° C.; the aluminum solder is an aluminum-silicon...

Embodiment 2

[0046] An embodiment of the water-based organic paste of the present invention, the water-based organic paste of the present embodiment comprises the following components in mass percentage:

[0047] Water-based organic solvent and water-based polymer (propylene glycol: carboxymethyl cellulose = 92:8) 89.7%, surfactant (sorbitan monolaurate) 6.3%, chemical deactivator (benzotriazole) 4.0%.

[0048] In this embodiment, an aluminum solder paste comprising the aqueous organic paste, the mass percentage of the aqueous organic paste in the aluminum solder paste is 40%, the aluminum flux, aluminum solder The total mass percentage in the aluminum solder paste is 60%, the weight ratio of the aluminum brazing flux to the aluminum brazing filler metal is: aluminum brazing flux: aluminum brazing filler metal = 1:5.0, and the aluminum brazing flux is fluorine Potassium aluminate, the melting temperature of the aluminum solder is 550-570°C; the aluminum solder is an aluminum-silicon alloy...

Embodiment 3

[0050] An embodiment of the water-based organic paste of the present invention, the water-based organic paste of the present embodiment comprises the following components in mass percentage:

[0051] Water-based organic solvent and water-based polymer (triethylene glycol: hydroxypropyl cellulose = 95:5) 88.0%, surfactant (sorbitan monostearate) 7.0%, chemical passivator (benzotri azole) 5.0%.

[0052] In this embodiment, an aluminum solder paste comprising the water-based organic paste, the mass percentage of the water-based organic paste in the aluminum solder paste is 35%, the aluminum flux, aluminum solder The total mass percentage in the aluminum solder paste is 65%, the weight ratio of the aluminum brazing flux to the aluminum brazing filler metal is: aluminum brazing flux: aluminum brazing filler metal = 1:2.5, and the aluminum brazing flux is fluorine Potassium aluminate, the melting temperature of the aluminum solder is 550-570° C.; the aluminum solder is an aluminum-...

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Abstract

The invention discloses water-based organic paste. The water-based organic paste comprises a matrix and an additive, wherein the matrix comprises a water-based organic solvent and water-based high polymer. The matrix of the water-based organic paste has a polar hydrophilic group, also has a non-polar lipophilic group, integrates the advantages of water and oil organic substances, abandons the defects of the water and oil organic substances, has mutual solubility with water, and can be blended with water; and in the presence of water-based high polymer, viscosity of the matrix is relatively high, so that anti-settling performances of the solder paste prepared from the matrix can be effectively improved. Meanwhile, the invention further discloses solder paste comprising the water-based organic paste. The aluminum solder paste can realize automatic charging, and also has the characteristics of being easy to clean, environmentally friendly, high in welding quality and the like.

Description

technical field [0001] The invention relates to an organic paste and an aluminum solder paste containing the paste, in particular to a water-based organic paste and an aluminum solder paste containing the paste. Background technique [0002] In industries such as kitchen utensils, small household appliances and electric heating appliances, brazing of aluminum-aluminum (aluminum alloy) and aluminum-stainless steel is often involved, and aluminum brazing flux and aluminum brazing filler metal are required. Aluminum brazing flux, whose main component is potassium fluoroaluminate, plays a chemical auxiliary role in removing the surface oxide scale of the base metal and aluminum brazing filler metal; aluminum brazing filler metal, whose main component is aluminum-silicon alloy, plays a role in firmly metallurgical the two base metals The main body of the connection is welded. The two are used together, and one is indispensable. The role of aluminum brazing flux is the first, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/362C09C1/40C09C3/08C09C3/10
Inventor 刘宏江曾燕贺军四蔡志红蔡沛沛焦均志胡泽宇余华钢李世婕蔡漫霞
Owner 广州有研焊接材料科技有限公司
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