Silver-tin-graphene composite bonding wire and preparation method thereof
A graphene composite and bonding wire technology, which is applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve the problem of high price of bonding gold wire, increased packaging cost, and poor solder joint eutectic and other issues, to achieve the effect of reducing packaging cost, improving internal crystal, and smooth surface
Active Publication Date: 2019-12-24
SICHUAN WINNER SPECIAL ELECTRONICS MATERIALS
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Problems solved by technology
Due to the high price of bonding gold wire, the packaging cost increases
The price of gold and silver alloy wire is relatively low, but in the packaging technology of high-end LED, COB and multi-pin IC integrated circuits, there will be defects such as bonding oxidation, insufficient push-pull force, and poor eutectic solder joints.
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[0038] In order to enable those skilled in the art to better understand the various technical solutions involved in the present invention, a series of specific examples are provided below to further describe the present invention in detail. It should be noted that, in the case of no conflict, the embodiments in this application and the specific technical features described in the embodiments can be combined in any suitable way; The possible combinations are not further described, as long as they do not violate the idea of the present invention, they should also be regarded as the content disclosed in the present invention.
[0039] In a specific embodiment, the silver-tin-graphene composite bonding wire provided by the present invention includes, by weight percentage: 0.05% graphene, 5% tin, 94.95% silver and unavoidable impurities.
[0040] In yet another specific embodiment, the silver-tin-graphene composite bonding wire provided by the present invention includes, by weigh...
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Abstract
The invention discloses a silver-tin-graphene composite bonding wire, which comprises: 0.05%-1.5% of graphene, 5%-10% of tin, 88.5-94.95% of silver and inevitable impurities. Compared with the existing technology, in the high-end LED and IC packaging, the cost of this new silver-graphene composite bonding wire is only 1 / 8 of the gold wire, which greatly reduces the packaging cost and effectively overcomes the problem of gold and silver. Alloy wire and palladium-plated copper wire have insufficient push-pull force during wire welding, poor ball planting at the second solder joint and sliding ball at the first solder joint. The solder joints can be well eutectic, and the bonding performance can reach the bond Alloy wire performance requirements. In addition, the present invention also provides a preparation method of the above-mentioned composite bonding wire.
Description
technical field [0001] The invention relates to the technical field of bonding wires for microelectronic packaging, in particular to silver-tin-graphene composite bonding wires, and also to a preparation method of the silver-tin-graphene composite bonding wires. Background technique [0002] Microelectronics wire bonding is a method of using fine metal wires, using heat, pressure, and ultrasonic energy to tightly weld the metal wires and substrate pads to achieve electrical interconnection between chips and substrates and information exchange between chips. Under ideally controlled conditions, electron sharing or interdiffusion of atoms occurs between the lead and the substrate, enabling atomic-scale bonding between the two metals. [0003] At present, gold wires, gold-silver alloy wires and palladium-plated copper wires are mostly used in the packaging of mid-to-high-end LEDs, COBs, and multi-pin IC integrated circuits. Due to the high price of the bonding gold wire, the p...
Claims
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IPC IPC(8): H01L23/49H01L21/48
CPCH01L24/43H01L24/45H01L2224/4321H01L2224/45111H01L2224/45139H01L2224/45193H01L2924/01047H01L2924/0105H01L2924/01006H01L2924/00011H01L2924/01049
Inventor 苏风凌吴国防陈伟郑太奎马珑珂王永贤袁丽
Owner SICHUAN WINNER SPECIAL ELECTRONICS MATERIALS