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Semiconductor structure

A semiconductor, patterned conductive layer technology, applied in the direction of semiconductor devices, semiconductor/solid-state device components, electric solid-state devices, etc., can solve problems such as contact disconnection

Inactive Publication Date: 2018-03-09
NAN YA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] A technical aspect of the present invention is to provide a semiconductor structure to solve the problem that the contacts are prone to disconnection

Method used

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  • Semiconductor structure
  • Semiconductor structure
  • Semiconductor structure

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Embodiment Construction

[0035] A number of embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings.

[0036] figure 1 A schematic cross-sectional view of a semiconductor structure 100 according to an embodiment of the present invention is shown. Different embodiments of the present invention provide a semiconductor structure 100 . Specifically, the semiconductor structure 100 is a packaging structure.

[0037] Such as figure 1 As shown, a semiconductor structure 100 includes an electronic de...

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Abstract

A semiconductor structure is provided. The semiconductor structure includes an electronic component and a board structure. The board structure includes a dielectric layer structure and at least one elastomer. The dielectric layer structure has a mount region and a peripheral region surrounding the mount region. The electronic component is disposed on the mount region, and the peripheral region hasat least one first through hole. The elastomer is disposed in the first through hole. By disposing the elastomer in the peripheral region, the stress transferred from the mount region to the peripheral region is absorbed by the elastomer, such that the warpage of the peripheral region is lessened or disappears. Therefore, the bumps may not receive too much stress, and the joint issue can be avoided.

Description

technical field [0001] The present invention relates to a semiconductor structure. Background technique [0002] With the vigorous development of the electronic industry, electronic products are gradually entering the research and development direction of multi-function and high performance. In order to meet the requirements of high integration and miniaturization of semiconductor components, the requirements for semiconductor packaging structures are getting higher and higher, and unprecedented problems may also arise. For example, as the line width and pitch of the semiconductor package structure are getting smaller and smaller, the contacts become prone to disconnection. [0003] In order to further improve the various characteristics of the semiconductor packaging structure, the related fields have made great efforts to develop. How to provide a semiconductor packaging structure with better characteristics is one of the current important research and development topics...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/31H01L23/12H01L23/14
CPCH01L23/12H01L23/14H01L23/3121H01L23/13H01L23/15H01L23/3128H01L23/49811H01L23/49822H01L23/562H01L24/16H01L24/32H01L24/48H01L24/73H01L2224/0401H01L2224/04042H01L2224/06135H01L2224/06136H01L2224/16237H01L2224/32225H01L2224/48091H01L2224/48228H01L2224/4824H01L2224/73215H01L2224/73265H01L2924/00014H01L2924/15311H01L2924/157H01L2924/15788H01L2924/3511H01L2224/48465H01L23/49827H01L2224/48227H01L2924/00012H01L2224/45099H01L2924/00
Inventor 林柏均
Owner NAN YA TECH
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