Apparatus for testing semiconductor devices

A technology for semiconductors and devices, applied in the field of devices for testing semiconductor devices, can solve problems such as alignment difficulties, misalignment of solder balls, deformation of support films, etc., and achieve the goals of improving alignment accuracy, stabilizing alignment, and improving test reliability Effect
CN107797044AInactive Publication Date: 2018-03-13ISC CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ISC CO LTD
Publication Date
2018-03-13
Estimated Expiration
Not applicable · inactive patent

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Abstract

A test apparatus for testing semiconductor devices include an insert including an accommodating part receiving a semiconductor device and an opening part formed on the bottom surface of the accommodating part; a test socket provided with a plurality of connection terminals electrically connecting the semiconductor device to a tester; and an interposer disposed between the insert and the test socket and electrically connecting the semiconductor device to the test socket. Especially, the interposer comprises a first circuit board disposed on the test socket, and a second circuit board coupled tothe upper surface of the first circuit board, wherein the first circuit board comprises a plurality of via contacts connected between connection terminals and contact terminals of the semiconductor device so as to connect the contact terminals to the connection terminals, and the second circuit board comprises a plurality of guide holes into which the contact terminals are inserted. Accordingly,the apparatus can protect the contact terminals from being clamped, can accurately align with a semiconductor device having a small interval, and can stably connect the contact terminals to the connection terminals.
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Description

technical field

[0001] Exemplary embodiments of the present invention relate to an apparatus for testing a semiconductor device. More particularly, exemplary embodiments of the present invention relate to a semiconductor device testing apparatus for testing electrical characteristics of the semiconductor device by supplying a test signal thereto. Background technique

[0002] Generally, a semiconductor device can be formed on a silicon wafer used as a semiconductor substrate by repeatedly performing a series of manufacturing steps, and the semiconductor device can be manufactured into a finished product by further performing a dicing process, a bonding process, and a packaging process.

[0003] A semiconductor device can be judged as good or defective by a test procedure for checking electrical characteristics of the semiconductor device. An apparatus for testing semiconductor devices can be used to perform the testing step. The apparatus for testing the semiconductor devi...

Claims

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