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Transfer head, manufacturing method thereof, transfer printing method, and display panel manufacturing method

A production method and transfer printing technology, applied in the field of transfer heads, can solve problems affecting the reliability of the transfer printing process and transfer printing accuracy, increase the production process of display panels, and affect the production efficiency of display panels, so as to save production processes and improve production efficiency. Accuracy, the effect of ensuring alignment accuracy

Active Publication Date: 2020-06-19
SHANGHAI TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Apparently, this transfer method requires secondary transfer to transfer the micro light-emitting diodes to the receiving substrate, thus increasing the production process of the display panel and affecting the production efficiency of the display panel; and this method, the first The two transfer heads are flexible structures, which will affect the reliability and accuracy of the transfer process due to stress when they are bent

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  • Transfer head, manufacturing method thereof, transfer printing method, and display panel manufacturing method
  • Transfer head, manufacturing method thereof, transfer printing method, and display panel manufacturing method
  • Transfer head, manufacturing method thereof, transfer printing method, and display panel manufacturing method

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Embodiment Construction

[0083] The present application will be described in further detail below through specific embodiments and in conjunction with the accompanying drawings. It should be noted that the orientation words such as "up", "down", "left", and "right" described in the embodiments of the present application are described from the angles shown in the drawings, and should not be interpreted as limiting the implementation of the present application. Example limitations. Furthermore, in this context, it also needs to be understood that when it is mentioned that an element is formed "on" or "under" another element, it can not only be directly formed "on" or "under" another element, but also be formed "on" or "under" another element. An element may be formed "on" or "under" another element indirectly through intervening elements.

[0084] refer to Figure 1-5 , Figure 1-5 In a specific embodiment of the method for transferring micro-LEDs to the transfer head provided in the present applicat...

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Abstract

The invention relates to the technical field of display, in particular to a transfer head, a fabrication method thereof, a transfer printing method and a fabrication method of a display panel. The transfer head is used for transferring a micro light-emitting diode to be transferred supplied to a substrate to a receiving substrate and comprises at least two rigid parts and a flexible part, each rigid part is used for picking up and placing the micro light-emitting diode, and two adjacent rigid parts are connected by the flexible part. By the transfer head, the fabrication process of the displaypanel is saved, the alignment accuracy of the micro light-emitting diode and the receiving substrate can be ensured, so that the fabrication accuracy of the whole display panel is improved.

Description

technical field [0001] The present application relates to the field of display technology, in particular to a transfer head, a manufacturing method thereof, a transfer printing method, and a manufacturing method of a display panel. Background technique [0002] Micro-LED (Micro-LED) is a device with a size between several microns and hundreds of microns. Because it is much smaller than ordinary LEDs, it can reduce the distance between two adjacent pixels from millimeters to Reduced to the micron level, therefore, it becomes possible to realize a micro-light-emitting diode display panel by using a micro-light-emitting diode array. [0003] In the prior art, the production of micro-light-emitting diode display panels usually first forms micro-light-emitting diodes on the supply substrate, and then transfers the micro-light-emitting diodes to the receiving substrate through the transfer head, and then packages the receiving substrate to form micro-light-emitting diodes display...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/683H01L21/677G09F9/33
CPCG09F9/33H01L21/67703H01L21/683
Inventor 李洪徐松嵩
Owner SHANGHAI TIANMA MICRO ELECTRONICS CO LTD