Printed wiring board manufacturing method, printed wiring board protective film and sheet-like laminate used for the method
A manufacturing method and a technology for wiring boards, which are applied in the directions of manufacturing printed circuit precursors, printed circuit manufacturing, chemical instruments and methods, etc., can solve the problems of increasing the burden of peeling and peeling films, and achieve the effect of superior manufacturing efficiency.
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no. 1 Embodiment approach ＞
[0031] figure 1 (a)~ figure 1 (d) is a schematic cross-sectional view for explaining each process in the manufacturing method of the printed wiring board by one embodiment of this invention, respectively. first as figure 1 As shown in (a), the printed wiring board 10 is placed on the release sheet 40 . Preferably, a plurality of printed wiring boards 10 are placed on a release sheet 40 as shown in the illustrated example. The release sheet 40 can be omitted. At this point, refer to figure 1 (c), the printed wiring board 10 is directly placed on the lower pressing board 52 which will be described later.
[0032] Furthermore, the sheet-like laminated body 20 is placed on the printed wiring board 10 . A typical sheet-like laminate includes the functional part 21 , the release film 22 provided on one side of the functional part 21 , and the first adhesive layer (A) provided on the other side of the functional part 21 . In a typical form, the sheet-like laminated body 20 is ...
no. 2 Embodiment approach ＞
[0047] figure 2 (a)~ figure 2 (d) is a schematic cross-sectional view for explaining each process in the manufacturing method of the printed wiring board based on another embodiment of this invention, respectively. Hereinafter, only specific parts in this embodiment will be described. The same reference numerals are assigned to the same printed wiring boards, films, sheets, adhesives, and the like as those in the first embodiment, and explanations thereof will be omitted. In addition, the description of the first embodiment can be applied to the case where the operating conditions and the like are not described in detail.
[0048] In this embodiment, if figure 2 As shown in (b), instead of including the main body 31 and the second The printed wiring board protective film 30 of the second bonding agent layer (B1). Based on this embodiment, in figure 2 In the hot pressing of the intermediate laminate shown in (c), the printed wiring board protective film 32 and the rel...
no. 3 Embodiment approach ＞
[0050] image 3 (a)~ image 3 (d) is a schematic cross-sectional view for explaining each process in the manufacturing method of the printed wiring board based on still another embodiment of this invention, respectively. Similar to the second embodiment, only specific parts in this embodiment will be described.
[0051] In this embodiment, if image 3 As shown in (a), the sheet-shaped laminated body 20' containing the 3rd adhesive bond layer (B2) on the surface (printed wiring board protective film side) of the peeling film 22 was used. Associated with this, in this embodiment, as image 3 As shown in (b), a printed wiring board protective film composed of the main body portion 31 is used instead of the printed wiring board protective film including the main body portion 31 and the second adhesive layer (B1) in the first embodiment. 30. That is, the printed wiring board protective film in this embodiment may not have an adhesive layer on the surface on the side opposite t...
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Abstract
Description
Claims
Application Information
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