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Method for preventing wafer sliding of vapor deposition film-forming equipment

A film forming equipment and vapor deposition technology, which is applied in gaseous chemical plating, metal material coating process, coating, etc., can solve the problems that cannot completely eliminate the sliding effect, prolong the wafer cycle, etc., and achieve the elimination of periodic sliding Phenomenon, the effect of prolonging the service life

Inactive Publication Date: 2018-03-30
SHANGHAI HUALI MICROELECTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method can only prolong the period of wafer slippage, and cannot completely eliminate the slippage effect.

Method used

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  • Method for preventing wafer sliding of vapor deposition film-forming equipment
  • Method for preventing wafer sliding of vapor deposition film-forming equipment

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Embodiment Construction

[0024] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0025] It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other.

[0026] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.

[0027] In a preferred embodiment of the present invention, a method capable of effectively eliminating slippage ...

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Abstract

The invention provides a method capable of effectively eliminating wafer sliding of vapor deposition film-forming equipment. The method is applicable in the field of semiconductor manufacturing and comprises the steps as follows: a plurality of virtual wafers are provided, and whether the wafers to be subjected to deposition exist on a heating device is detected before deposition, cleaning and surface treatment processes begin; if the wafers to be subjected to deposition do not exist, the virtual wafers are loaded on the heating device, and then operation is started; and if the wafers to be subjected to deposition exist, operation is started directly. With the method, the periodical wafer sliding phenomena of the equipment can be effectively eliminated, meanwhile, the service life of the heating device can be prolonged, and actual production is facilitated.

Description

technical field [0001] The invention relates to the field of semiconductor manufacturing, in particular to a method for preventing slippage of vapor deposition film forming equipment. Background technique [0002] PECVD APF (Plasma Enhanced Chemical Vapor Deposition Advanced patternfilm, plasma enhanced chemical vapor deposition amorphous carbon film) uses microwave or radio frequency to ionize the gas containing the constituent atoms of the film to form plasma locally, and the plasma chemical activity is very strong and very It is easy to react and deposit the desired film on the substrate. Because of its low reaction temperature, fast deposition rate, good film quality, less pinholes, and less cracking, it is widely used in semiconductor manufacturing. This amorphous carbon (APF) mask combined with DARC (Dielectric Anti-reflective Coating, dielectric anti-reflective coating) is used in advanced semiconductor manufacturing above 90nm. [0003] The PECVD APF equipment of A...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C16/458C23C16/26
CPCC23C16/458C23C16/26
Inventor 徐灵芝
Owner SHANGHAI HUALI MICROELECTRONICS CORP