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Target material and treatment method thereof

A target and body technology, applied in the field of coating machines, can solve problems such as the uniformity of thin-film square resistance films that cannot be solved

Inactive Publication Date: 2018-04-06
KONFOONG MATERIALS INTERNATIONAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a target material to alleviate the technical problem that the target material in the prior art cannot solve the film uniformity problem of the sheet resistance of the film during sputtering

Method used

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  • Target material and treatment method thereof
  • Target material and treatment method thereof

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Embodiment Construction

[0033] The technical solutions of the present invention will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0034] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, ...

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Abstract

The invention relates to the technical field of film coating machines, in particular to a target material and a treatment method thereof. The target material comprises a target material body, according to the magnetic field strength in the target material sputtering process, the upper surface of the target material body sinks towards the center of the upper surface of the target material body, sothat a cambered-surface groove is formed, therefore target material atoms are evenly sputtered on a base plate in the target material sputtering process, that is, the target material atoms can sufficiently gather towards the center in the sputtering process, then the target material atoms are evenly sputtered to the base plate, the situation that the thickness of a functional film formed on the base plate is uneven due to the fact that rapid sputtering is conducted by the place where the magnetic field of the target material body is strong, and the target material atoms are directly sputteredto the base plate can be avoided, and therefore the thin film evenness of a thin film square resistor can be effectively improved. Compared with the prior art, the target material treatment method hasthe above advantages, and no more detailed description is made here.

Description

technical field [0001] The invention relates to the technical field of coating machines, in particular, to a target material and a processing method thereof. Background technique [0002] The existing aluminum series MRC aluminum target SPA12 (AlSi) for semiconductor sputtering is a planar design. During the sputtering process of the target, due to the different manufacturing processes, the magnets selected are also different. The corresponding surface after sputtering The curves are also different. However, under different sputtering processes, the same sputtering target will produce different sputtering effects, and it is easy to cause problems such as thin film uniformity of thin film sheet resistance during sputtering, such as thin center and thick edge. It is difficult to meet customer requirements; the general method is to thicken the center of the planar target. However, increasing the thickness of the center target can only solve the problem of thin center and thick...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C14/34
CPCC23C14/3407
Inventor 姚力军潘杰王学泽赵梓聿
Owner KONFOONG MATERIALS INTERNATIONAL CO LTD
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